Electronics Forum: pattern match (Page 5 of 8)

Re: BGA ball missing.

Electronics Forum | Sun Aug 30 16:36:31 EDT 1998 | Steve Gregory

Hi Kc! I went to Surface Mount International last week, and had a chance to see a way to reball BGA's that is very simple, and not expensive at all. I've seen the advertisements in a few magazines, but this was the first time I've seen it live. It's

BGA Underfill

Electronics Forum | Thu Aug 23 20:31:53 EDT 2001 | davef

We never underfill BGA, but then again our products are not blasted into space. Certainly you need to provide enough room for the dispense head to move around the component in the pattern appropriate for the underfill you plan to use. Probably more

Re: Air-Vac stuff

Electronics Forum | Thu Aug 19 22:59:48 EDT 1999 | Jeff Ferry

| I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the ad

Re: Air-Vac stuff

Electronics Forum | Thu Aug 19 23:56:49 EDT 1999 | Earl Moon

| | I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the

Re: Air-Vac stuff

Electronics Forum | Fri Aug 20 09:33:51 EDT 1999 | Don Morgenstern

Earl & Jeff Our machine is different than the Electrovert Solder Pak in that it is does not behave like a "volcano". Jeff, please contact me if you have safety concerns as perhaps you also want to consider our equipment. | | I'm trying a second ti

Re: Air-Vac stuff

Electronics Forum | Fri Aug 20 13:00:16 EDT 1999 | ScottM

| I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the ad

ICT and specifying PCBA testing

Electronics Forum | Tue Nov 01 14:46:31 EDT 2011 | davef

Agilent TestJet Technology White Paper In the early 1990s, the testing of digital parts became problematical. Previous in-circuit test techniques sought to ensure a correct, functioning part by applying digital patterns, called vectors, to the input

Re: BS

Electronics Forum | Thu Aug 24 15:12:29 EDT 2000 | Earl Moon

I don't entertain the forum like JAXSUN. I never have played games but for some humorous insights. I, when participating, never complained until management provided only more incentive to advertisers than forum members. That said, the following is a

Re: Why are squares better than round ones?(and a update on my lil' nightmare)

Electronics Forum | Wed Apr 28 12:18:04 EDT 1999 | Scott McKee

| Hello all, | | I read about Steve's headache a few articles back and I'm really interested by his tip. However, I'm still wondering why square apertures release solder paste better than round ones. For the same volume of paste, the surface area

Re: Air-Vac stuff

Electronics Forum | Fri Aug 20 14:19:47 EDT 1999 | Earl Moon

| | I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the


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