Electronics Forum | Thu Aug 28 23:15:44 EDT 2014 | phyllishwl
Hi all, Our production reported that they found 3 panels out of 53 panels with strange phenomenon after reflow. 1/ Blister / Delamination of PCB panels, 2pcs blister/delamination under solder mask, 1pc under Gold plating at Gold finger 2/ Silkscr
Electronics Forum | Thu Jul 03 08:40:23 EDT 2003 | Kris
Hi, undercured solder resists may be a defect people have seen so far. Some of the probles arising is blistering as well as reaction with wave solder flux that may lead to some kind bad gel like formations. Gels the idea would be to reflow the ba
Electronics Forum | Fri Jul 28 16:36:37 EDT 2006 | chrisgriffin
Thats a great idea Doc. If we all listened to your suggestions, there would be zero defects in PCB manufacturing. I bet your using Bahodum solder which, I'm sure, is incapable of defects. Pavel, sounds like you can rule out reflow as the problem.
Electronics Forum | Mon Apr 14 14:11:30 EDT 2008 | cyber_wolf
I dont know if this is related, but there appears to be a blister/measle in the upper right corner of the Q19 large pad. (upper right of Q19 as you are facing the photo) If your profile and paste is good, my bet would be that there is something wron
Electronics Forum | Thu Aug 21 16:00:31 EDT 2014 | davef
This links to a NPL presentation on moisture removal from PCB http://www.npl.co.uk/upload/pdf/20140318_effect_baking.pdf Consider: * Focusing on preventing moisture contamination of boards, rather than removing moisture * There will be no standard
Electronics Forum | Mon Feb 05 17:18:53 EST 2001 | davef
Wha, Nellie!!! Delamination & Blistering IPC-A-600D Although it may occasionally occur because of a severe process breakdown, delamination and blistering occurs as a result of an inherent weakness of the material. Either condition represents a brea
Electronics Forum | Wed Jun 09 10:32:37 EDT 2004 | Sherri
Fiber from where the board is scored and separated. Is it possible for traces of copper to be present in that area of PCB?
Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Wed Jul 06 13:22:25 EDT 2005 | Dreamsniper
Can anyone help me on where to find reference for the above info other than IPC2221 as it is not covered by the said standard. I am looking for a proper trace spacing for my lightning protection circuit on my PCB for the following requirements: 750
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