Electronics Forum: pin in paste (Page 5 of 104)

Insufficient Heel Fillets on plastic 240 pin QFPs

Electronics Forum | Thu Mar 22 16:02:37 EST 2001 | dblsixes

In the end, we may have to go to our customer to see if we can get Class 3 relief ... We actually did an experiment by adding a ceramic cap to the top of the part, using a thermal paste to improve the thermal connection. It didn't do much for us ..

Samtec Searay 500 pin connector solder wicking issue after reflow

Electronics Forum | Tue Jan 14 10:41:49 EST 2020 | robl

Hi Arnel, I've used these before but with a 0.005" stencil. The key issue here was that the pins are actually a solder preform at the base that melts into the board - sort of BGA like, so too much paste can cause issues. Samtec have some great app

Insufficient Heel Fillets on plastic 240 pin QFPs

Electronics Forum | Thu Mar 22 15:44:50 EST 2001 | pteerink

I have a board with QFP240 plastic package exhibiting the same characteristics. Minimum heel fillet that doesn't change with stencil mods, paste change, profile change etc ( I am working to class 2, though, so my pass spec, although they are not pret

Insufficient Heel Fillets on plastic 240 pin QFPs

Electronics Forum | Thu Mar 22 15:45:20 EST 2001 | pteerink

I have a board with QFP240 plastic package exhibiting the same characteristics. Minimum heel fillet that doesn't change with stencil mods, paste change, profile change etc ( I am working to class 2, though, so mine pass spec, although they are not pr

Samtec Searay 500 pin connector solder wicking issue after reflow

Electronics Forum | Tue Jan 14 11:39:51 EST 2020 | avillaro2020

Thanks Robl. I’ve contacted samtec followed their advice but ended up empty handed. Originally my stencil thickness is 6 mils, samtec stressed the need for the paste and charge to have good contact but this is challenged by the inherent charge non-co

Samtec Searay 500 pin connector solder wicking issue after reflow

Electronics Forum | Wed Jan 15 10:31:55 EST 2020 | emeto

Having 10c thermal differential is a lot. Trying different paste might help - usually thermal expansion makes component detach from PCB, then joint is formed and solidified, then component goes back but is too late to form a joint. Cooling speed migh

Insufficient Heel Fillets on plastic 240 pin QFPs

Electronics Forum | Thu Mar 22 21:10:42 EST 2001 | dblsixes

Ah ha! ... You hit upon something that I discovered earlier today ... As I said in an earlier post, I was going to experiment with dog-boning the solder paste ... But upon further review, I discovered that our customer removed 75% of the pad behind t

Samtec Searay 500 pin connector solder wicking issue after reflow

Electronics Forum | Wed Jan 15 11:18:51 EST 2020 | avillaro2020

Hi Evtimov, Thanks again! The solder wicking/open solder joint is not actually gross rejection, it is only a few and appeared random (difficult to trend the location of the opens), what is perflexing is that i have this 1 or 2 open solder joints sur

Insufficient Heel Fillets on plastic 240 pin QFPs

Electronics Forum | Thu Mar 22 13:41:41 EST 2001 | mparker

What's the reality of the situation? Are you creating a specmanship issue here just to satisfy Class 3? Can you demonstrate that the paste volume applied to the plastic QFP's give sufficient overall fillets for mechanical and electrical properties? W

Tin Lead BGAs in leadfree paste ( pb-free paste )

Electronics Forum | Mon Mar 06 22:30:12 EST 2006 | mainenetservices

We have a customer transitioning slowly to lead free due to necessity rather than a need to comply i.e. some of their BGAs can only be purchased Pb free only. So for this we would want to produce them a leadfree soldered PCB (not necessarly RoHS comp


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