Electronics Forum: pin plating issue after soldering (Page 5 of 22)

Problem with less soldering material on the pins

Electronics Forum | Thu Apr 20 03:50:35 EDT 2017 | cromaclear

To overcome the dewetting issues of the past, a number of techniques have been used such as alternating directions on the wetted nozzle; this helps to avoid the solder biasing to one side causing the other side to oxidize and de-wet. Another method o

Modems reflow mistake

Electronics Forum | Mon Oct 12 15:51:47 EDT 2015 | davef

IPC-A-610E-2010, Acceptability of Electronic Assemblies, 8.3.4 Castellated Terminations talks to the acceptability of solder connections on components like yours. It’s tough to say from the pictures, but I’d say your issues are: Missing solder: Plat

Delta wave solder

Electronics Forum | Mon Jun 12 07:52:21 EDT 2017 | tch

We have had this issue on our Delta 3 waves and determined that there are small pin holes in the solder pot. We had plates welded to the outside of our solder pot on the lead free wave and this bought us enough time until we could replace the wave, a

PIHR Inspection Criteria

Electronics Forum | Thu May 17 07:36:40 EDT 2001 | Bob Willis

Here is a copy of a draft document on PIHR Inspection I have jotted down on a flight to Scotland yesterday, any comments suggestions etc ? I have already most of the photos for the standard but as you know there is nothing in the IPC document it just

Re: wetting

Electronics Forum | Tue Dec 18 18:36:58 EST 2001 | guicho_v

Is the Sn% of the plating of the pin related to wetting quality?. I am having issues with one IC maker where some pins are OK and one or two pins are not soldered, even when there is weeting evidence underneath the pin. I am blaming the %Sn too hig

Solder Ball Attach (BGA)

Electronics Forum | Mon Sep 24 12:58:31 EDT 2018 | vincentl

We are attaching 0.50mm diameter SAC 305 solder balls onto 0.38 diameter Au plated pins placed at a 0.80mm pitch (pins are pressed into a plastic insulator). A tacky flux is then stenciled onto the pins using a stencil with.a 0.38mm diameter aperture

hybrid solder joints

Electronics Forum | Thu May 13 21:45:14 EDT 1999 | ardis

I am seeing reflow around my signal pins after being subjected to a profile of 204c for 1 minute and 225c for a min of 30 seconds. Signal pins are soldered into a copper plated alum. case with SB5 and then silver plated. The pins have a hot oil tin

Reflow solder issues with 6pin SOT's

Electronics Forum | Tue Aug 09 12:09:26 EDT 2005 | mtd

I am having reflow issues with small 6 pin SOT's. The joints on these components still look like solder paste after the reflow oven. I have tried adjusting the profile on forced air oven. Any recommendations as what to change in the profile or proces

Selective Gold Plating

Electronics Forum | Mon Sep 24 22:56:52 EDT 2018 | sarason

IF you are wanting to do to this you are to late in the process. The gold is usually applied after the copper etching of the multilayer sandwich. The edge is extended beyong the board edge and the all pins are connected together with a bussbar. The b

Solder wicking up on connector leads

Electronics Forum | Tue Sep 16 17:03:34 EDT 2014 | rangarajd

We have an issue with solder wicking up the leads/ inside terminations on an SMT connector. The solder coverage is sometimes over 50% of the connectors inside pin length. The terminations are gold plated. Is there an IPC spec for acceptability? Plea


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