Electronics Forum | Fri Jan 12 09:17:36 EST 2001 | Dave F
Mir is getting set-up to do a 10 point full gainer with a twist into the Pacific Ocean sometime in Febuary. So, this is your last chance to check it out in the night skies. As they say as you exit the plane ... bahbeye
Electronics Forum | Fri Aug 25 02:15:42 EDT 2000 | SMT Tech
Is it board specific? If so I used a piece of sheet metal between the board and the heaters to correct a similar issues, where a ground plane was absorbing the heat.
Electronics Forum | Fri Jun 16 11:08:30 EDT 2000 | Travis Slaughter
Did you try preheating the board then hand solder? Those little heat shrink guns work great for this.
Electronics Forum | Mon Dec 18 17:56:26 EST 2000 | Dave F
Does the thermal conductivity of a copper trace on a printed circuit board change as the copper oxidizes? Is the oxide on copper a thermal insulator? If so, should it be considered in an analysis of thermal resitivity between a ground plane and a h
Electronics Forum | Wed Dec 15 07:03:09 EST 1999 | Chris May
Marlies, The IPC definition, which I think we can trust, says that Coplanarity is defined as lying or acting in the same plane. In other words Coplanarity means no bent legs, pins. Regards, Chris.
Electronics Forum | Thu Dec 16 06:59:12 EST 1999 | Calvin Wong
Coplanarity also takes into consideration which is your reference plane. In the case of connectors, you can consider coplanarity between the highest and the lowest lead. Also, you can consider all the connector leads with reference to the connector
Electronics Forum | Thu May 09 17:19:28 EDT 2002 | davef
Can�t help you with the article that you read. Other places to start are: * 2221, 7.2 Heat Dissipation Considerations, 7.3 Heat Transfer Techniques, and 8.1.10 Heat Dissipation * 2222, 9.1.2 Thermal Relief In Conductor Planes
Electronics Forum | Wed Sep 25 13:38:35 EDT 2002 | finepitch
Yannick, If we leave the 201 issue aside; have you checked where those BGA pads are connected to? Could those be power/ground balls connected to large (difficult to heat up) planes by any chance? Erhan
Electronics Forum | Fri Oct 11 09:28:14 EDT 2002 | davef
Designers love to do BIG copper pours for several reasons: * Maximize heat spreading. * Increase EMI shielding. * Laziness. The poor folk that solder the parts on boards HATE big copper planes near solder pads. During soldering, fat copper traces [
Electronics Forum | Wed Nov 20 09:23:58 EST 2002 | Adam
Is it possible to achieve a 100% top-side solder fillet where pin 1 on the device is attached to a ground plane ? we've optimised the wavesoldering and fluxing operations, but without much success on that pin, every other pin is fine. Any advice woul
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