Electronics Forum | Thu Aug 05 20:40:13 EDT 2004 | Haran
Is 1 thou of copper refer to 1 mil or 1 mm.?In Asia,we do not really use this unit.Please advise.
Electronics Forum | Thu Aug 05 20:42:11 EDT 2004 | Andrew
If the moisture does not has path to escape,what will happen to the entrapped moisture ,will there be a problem in the asssembly process?
Electronics Forum | Thu Aug 05 21:17:24 EDT 2004 | davef
A 'thou' is a 'mil'. It's intended use to to distinguish 'mil' from 'milli' [obviously with marginal success].
Electronics Forum | Wed Feb 05 11:21:24 EST 2003 | pjc
First off, get them designed out. I had this problem once and filled them with SMD adhesive and cured prior to printing. We were careful to be sure the solder lands were clean of any adhesive prior to curing. It worked out very well and we did this p
Electronics Forum | Mon Feb 10 05:32:44 EST 2003 | matherat
BPan, I would like to discuss a possible solution to this that involves some of the suggestions found here but, with a twist that our process offers. This would be better discussed one on one somewhere other than this forum so if you still need sugg
Electronics Forum | Wed Aug 01 12:16:58 EDT 2007 | realchunks
So how do you think they plate the vias to the components? This was where the cost came in when trying this. Now how do you keep multi-layers together without putting undo pressure on you components? Thru-hole components still would require solder
Electronics Forum | Mon Aug 07 13:27:40 EDT 2017 | dleeper
Are you seeing this on bare PCBs or after assembly? with Immersion silver, the finish over the copper should be very thin and uniform, that's the main advantage of ImAg. You should not be seeing excess plating filling vias unless: A)Its HASL, not
Electronics Forum | Wed Jun 10 15:10:55 EDT 1998 | Rich
I am looking for the Industry standards on vias. Are they required to be plated with solder or is copper plating enough? What about reliabilty with either one? Also, if tenting the via is required should it be copper plated or solder plated over c
Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef
Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the
Electronics Forum | Thu Sep 02 22:23:44 EDT 2004 | davef
Dunno about something formal. After you specify your hole size and fill material, why not say something like: " Surface to be planar prior to final plating and metallization. Boards must be suitable for via in pad technology." We do not allow plati
