Electronics Forum | Tue Jan 17 23:25:55 EST 2012 | ngineer
I think I've got it. 1. Black flat connectors are for the nozzle changers, and whether or not the tab is pushed in or out (depending on whether they are placed in front of one of the blocks on the feeder base doesn't matter at all, the blocks are th
Electronics Forum | Mon Jul 26 18:01:30 EDT 1999 | Earl Moon
| Presently protos of micro-bgas (80i/o) pitch .030/.031 | 12BGA per assembly | | The board is a (.062, 4 layers) FR-4 using Dry film | Pads .014inch | Vias within footprint .020inch | Vias to be filled by bottom side(solder side) only .030in dia. F
Electronics Forum | Tue Mar 22 20:33:24 EST 2005 | davef
Q1. What are you guys doing for filled/tented/plugged vias on the BGA site? A2. 2221A, 4.5.1 tells you the vias have to be tented on both sides. Q2. What type of issues can this cause if using no filled/tented/plugged vias on the BGA site? A2. BGA
Electronics Forum | Thu Apr 26 09:05:16 EDT 2007 | realchunks
Hi D0m0 Can you standardize on your temps and just adjust conveyor speeds for various sizes of the boards? Another trick is to parallel t-couple plug off the actual t-couples of the oven and mount the plug in an easy access point of the oven. The
Electronics Forum | Fri Feb 22 14:22:07 EST 2008 | stevek
Are you using nocleans, especially when you get to SMT? Years ago, I had OA wave flux get into vias that were plugged from the top under parts. It is really difficult to clean small, high aspect ratio vias. Cross sections showed that the copper in
Electronics Forum | Thu Jan 02 04:56:38 EST 2014 | bobpan
Here is a couple of things to look at: 1. Make sure the boards are plugged into the correct position. Also just leave out the transport card to see if its hanging up the machine. The transport board should be the board all the way to the right. 2. M
Electronics Forum | Mon Apr 28 09:53:10 EDT 2003 | kmorris
I've got a set of apertures on a stencil that I would like to "plug" or block off. In the past we've done this with Kapton tape, but since this location is close to a fine pitch component, the thickness of the tape prevents good gasketing at the fin
Electronics Forum | Tue Aug 23 03:42:10 EDT 2005 | Adeline
presently, the production facing this problem. We has couple of brd which is electroylic gold finishing with plug via. The brd has blister after the PCBA (in lead free temperature, 265 degree) Some time, bare brd already has the blisters. But most of
Electronics Forum | Tue Oct 17 11:51:23 EDT 2006 | SteveT
where I can get an install disk for a Comtrol RS232/422 Interface controller? We're upgrading a PC and I need to move the controller but obviously this thing isn't going to be plug n' play, or even plug n' pray. I'm assuming there is one because I c
Electronics Forum | Fri Jul 13 18:25:09 EDT 2007 | seankim10
It sounds like more has to do with plating. you may also check out the voiding issue especially if you have new FAB or the supplier. I had problems with a RF chip in QFN package due to insufficient grounding that voiding caused. This ground is often
