Electronics Forum: poor wash under bga (Page 5 of 7)

Re: Cleaning under, around, and through tight spaces

Electronics Forum | Tue Jan 05 20:29:32 EST 1999 | Steve Gregory

| A question for you all! | | Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. | | My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clean under 20

Re: Cleaning under, around, and through tight spaces

Electronics Forum | Wed Jan 06 09:55:22 EST 1999 | Chrys

| | A question for you all! | | | | Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. | | | | My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clea

Re: Cleaning under, around, and through tight spaces

Electronics Forum | Tue Oct 12 17:24:27 EDT 1999 | Kevin Ham

| | A question for you all! | | | | Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. | | | | My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clea

SMT process Blowhole/ Pinhole

Electronics Forum | Sat Mar 29 08:38:28 EST 2003 | davef

Iman When you talk about your profile, can we assume you're measuring it on the pads of LGA? Profile the solder paste reflow by placing a thermal couple under the component pad, similar to a BGA. On a slight tangent, as with soldering BGA, paste

LGA component rework process on SRT machine

Electronics Forum | Sat Jun 05 13:38:22 EDT 2021 | ppcbs

For Linear Tech LGA's we solder bump the LGA using a .30mm solder ball then reflow with a tacky flux. This will provide a void free solder joint and adds a little height to the solder joint in case you use a flux that you want to clean from under th

Re: Gold Finger Cleaning

Electronics Forum | Sat Nov 14 08:05:54 EST 1998 | Earl Moon

| | | | I believe that gold fingers on my circuit boards are being | | | | contaminated and need to clean them with some chemical | | | | solution. Any recommendations. | | | | | | | Chuck: What is the type and source of your contamination? Dave

Re: CSP Assembly- No-clean vs Aqueous

Electronics Forum | Wed Dec 30 17:34:23 EST 1998 | Michael Allen

I'm afraid we don't agree regarding the best test method to use here. My understanding is as follows. The omegameter test measures board-level, ionic contamination (i.e., average for the entire board area and all components); it does not tell you w

Re: CSP Assembly- SIR Test

Electronics Forum | Thu Dec 31 14:20:35 EST 1998 | Michael Allen

Kelvin, Yes, we're referencing the same spec. I performed the test under the Class 2 conditions (except that I used a 100V bias rather than 50V...but my water-washed microBGAs still passed). Regarding the omegameter test: we have this instrument,

Humiseal 1A33 conformal coating using automated atomized spray

Electronics Forum | Tue Jul 03 01:54:42 EDT 2018 | rdhiman1

Reaching out to all conformal coating experts, please help! While setting up conformal coating using the automated atomized spray, we observing issues associated with conformal coating wetting on the following regions: 1) Component edges 2) Metalli

uBGA (.5mm pitch) printing woes

Electronics Forum | Tue Sep 19 09:41:30 EDT 2017 | sumote

Steve, The 4 things I would do, and in this order: 1. Clean your stencil with stencil cleaner wipes after it comes out of the stencil cleaner. I like MicroCare ProClean (MCC-PROWR). I will even saturate the wipe with a bit of isopropal just till


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