Electronics Forum | Fri May 21 15:40:58 EDT 1999 | JohnW
| | | hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | | | | | your help is greatly appreciated...thanks | | | | | | omat marasigan
Electronics Forum | Fri Apr 23 08:45:33 EDT 1999 | Steve LeCour
At Sanders (Military manufacturer), we have only started using plastic parts within the past few years. After being tasked with reviewing the new J-Std-033, it became obvious to me our process for controlling device exposure is weak. We build very lo
Electronics Forum | Thu Feb 04 09:22:56 EST 1999 | Terry Burnette
| Hello all, | | Are BGA's easy to develope shorts? If a process is stable and all of a sudden you get BGA's shorting out on you, what might be problems? | | We've checked our solder paste amount, and we've rechecked our reflow profiles and nothin
Electronics Forum | Thu Oct 05 09:31:41 EDT 2000 | Daniel
Hi! Does anyone have experience from PCBs with mixed technology. Do you store the PCBs in nitrogen/dry air cabinetts if you�re not able to wavesolder the PCBs within the same day. What considerations need to be taken concerning popcorning/delaminati
Electronics Forum | Mon Jun 18 16:48:00 EDT 2001 | Gil Zweig
We have found a significant number of PBGA problems associated with physical deformation of the package. Deformations such as dishing (potatoe chipping) and delamination under the die (popcorning). These can be detected by x-ray by the variation patt
Electronics Forum | Mon Oct 18 11:48:57 EDT 1999 | Dave F
No, but answer me this? 1 What type of BGA? 2 What's the wave process, materials and temps? Are you waving the BGA or top-side flowing it? 3 If the BGA is plastic, what are you doing to prevent/remove entrapped moisture before solder processing?
Electronics Forum | Fri May 15 04:06:33 EDT 1998 | Alan Pestell
We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. How d
Electronics Forum | Mon Oct 21 08:46:15 EDT 2002 | davef
60% ||||36% of ball area|| >36% ||Class2|| Accept|| Reject ||||45% of ball diameter|| >45% ||||20.25% of ball area|| >20.25% ||Class3|| Accept|| Reject ||||30% of ball diameter|| >30% ||||09% of ball area|| >09% II. Missing Ball: This is prohi
Electronics Forum | Mon Feb 07 21:36:20 EST 2005 | Grant
Hi, We had quite a bit of problems when we allowed popcorn onto the shop floor, so we changed to M&M's but the problems persisted. We changed our operator feeding process over to KFC, and ever since there has been a dramatic improvement in productio
Electronics Forum | Wed Sep 13 12:42:48 EDT 2006 | russ
much prefer using percentage instead of fixed overage. Example.... A run needs 100,000 parts, (1% shrink is 1000 parts!) you want to only issue 60 over? I recommend 2% for popcorn and exact for retrievable/ identifiable parts like sticks and trays
