Electronics Forum | Thu Dec 21 13:11:25 EST 2006 | SWAG
We have fought with cut-tape way too much. It's always a bad idea. We've tried a couple methods/devices for manual splice with limited success. Before you look into this I would ask them if they could supply you cut tape qty's inslusive of fairly
Electronics Forum | Wed Sep 24 08:34:57 EDT 2003 | stefwitt
Even when you run a board several times, the machine may not make the same travel path every time. This in itself does not create a problem, but the vacuum on the nozzles could be different, dependent on the configuration of components on the heads.
Electronics Forum | Fri Mar 14 11:25:02 EDT 2008 | hegemon
ol' hege has got to agree with Chunks and Dave. Seems every time there is a problem, the finger is first pointed at the process. For my $.02 it doesn't matter if your process is 100% bulletproof, procurement will screw it up by finding a vendor that
Electronics Forum | Mon Oct 15 10:51:49 EDT 2001 | davef
On over printing, the general issues are: * Paste deposits being so large that when reflowing, collapse onto many, rather than a single solder mass. * Paste expanding during heating and being close to other solder deposits and bridging [as you say].
Electronics Forum | Thu Mar 03 09:04:26 EST 2005 | russ
Been following this thread and have a question, Why do "touch-up" people follow different criteria than "Q.C." people. It sounds like the root of the problem is not addressed but bandaids are being put into place. We have no "Q.C." department and
Electronics Forum | Tue Aug 05 21:08:10 EDT 2014 | isd_jwendell
You are correct about the Manncorp machine, it was an MDC machine. The Essemtec machine is old(ish) but still runs fine, and last I knew they were still supporting it. My recent problem with Essemtec was in regards to software. I found a bug and sim
Electronics Forum | Mon Sep 12 09:26:00 EDT 2016 | awhite
Our MPM Up2000 HIE is having a communication problem with any upstream machine we place in front of it...i.e. conveyor, board loader, etc. It all started when we removed a conveyor from inbetween it and a board loader, and hooked those machines up di
Electronics Forum | Tue Aug 21 08:34:03 EDT 2007 | rgduval
We have the same problems with cut/tape parts. But, we specialize in short-run prototypes, so I don't have much of a choice but to deal with it, and find a way to make it as easy as possible. We just demo'd a splice tool from Sierra Electronics (ww
Electronics Forum | Wed Oct 30 09:43:01 EST 2002 | gregp
Larger tighter spaced balls will present a problem in sealing the vacuum cup. There will be more leakage in this case. It really depends upon the application. The BGA you mention should not be a major concern. The bigger problems are with bigger
Electronics Forum | Sun Aug 26 12:40:59 EDT 2001 | stefwitt
I would like to enter the discussion by tossing some numbers in. First of all I don�t like the 3 Sigma value. 3 Sigma are 2000 defects per mio. if I remember correctly. This means, if you have 200 components on the board, then every 10 boards have on
