Electronics Forum | Sun Apr 04 00:51:01 EDT 2010 | jmelson
On the Xilinx chips, I am pretty sure these hairs are NOT tin whiskers. The solder in this particular build was SnPb, and pure tin would almost certainly melt at soldering iron temperatures. My theory is that slivers of the lead frame material, lik
Electronics Forum | Fri Mar 20 07:42:44 EDT 2015 | eezday
Dendrite growth is not typically associated with a flux reation but rather is a result of mechanical stress. The stress can be from any source including stress induced by other components, environment, plating or even bimetallics. Dendrites are most
Electronics Forum | Thu Sep 11 11:34:52 EDT 2008 | patrickbruneel
Interesting observation Manuel. I will be blamed again for crying wolf but look below a lot more defects will soon see the daylight all related to lead-free. This information was posted at the tin whisker forum by Bob Landman of H&L Instruments.
Electronics Forum | Fri Jun 03 16:52:48 EDT 2005 | davef
Your customer is being smart. When we look at the evaluation that some component suppliers do in assessing the potential of the pure tin solderability protection they've chosen to produce tin whiskers, we just shake our heads. Essentally they say,
Electronics Forum | Wed Aug 18 11:52:35 EDT 1999 | Brian
| WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. | WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. | WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE PADS.
Electronics Forum | Mon Oct 03 10:41:57 EDT 2011 | patrickbruneel
Some of us here attended the 5th CALCE international symposium on tin whiskers http://www.calce.umd.edu/symposiums/ISTW2011.htm where one of my former professors, Dr. Henning Leidecker, talked about the tin whiskers he and the others at NASA Godda
Electronics Forum | Wed Oct 08 09:25:45 EDT 2008 | dphilbrick
Kinda got that Mike but here is the problem. I have 1.8 mil parts that need to be NON-RoHS. 85% of those parts being STD R's and C's. I am looking for a place that provides at close to standard cost R's and C's with something besides pure tin termina
Electronics Forum | Wed Mar 04 11:16:25 EST 2009 | patrickbruneel
From your description of the problem first reduced SIR to dead short is exactly what happens with dendrite growth. What is needed to form them is low bias voltage (10 volt range is ideal with low current), a surface, 2 conductors (containing tin), io
Electronics Forum | Tue Apr 29 09:43:30 EDT 2003 | davef
With a nickel barrier and 'tin' plating, reconsider your reflow recipe to reduce the leaching of the termination into the solder during reflow. Points are: * In designing a reflow temperature recipe, it is important that the temperature be raised at
Electronics Forum | Thu Aug 07 11:58:36 EDT 2008 | pbarton
We have experienced the same problem with Pd/AG and P/Ag terminations on precision resistive parts. The problem is dissolution of the termination metallisation into the bulk solder. This is exacerbated by the higher thermal profiles required for RoHS
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