New Equipment | Industrial Automation
BENTLY NEVADA 350032 4-channel relay module （New in stock,1 year warranty) CONTACT US: EMAIL:sales2@amikon.cn WEB:www.amikong.com SKYPE:ariatang111 MB(WHATSAPP):+86-18020776791 WECHAT:18020776791 ADVANTAGES: SCHNEIDER 140CPU43412U,140CPU6515
New Equipment | Industrial Automation
BENTLY NEVADA 350042M BENTLY NEVADA Speed acceleration BENTLY NEVADA Monitoring module, （New in stock,1 year warranty) CONTACT US: EMAIL:sales2@amikon.cn WEB:www.amikong.com SKYPE:ariatang111 MB(WHATSAPP):+86-18020776791 WECHAT:18020776791 ADVA
New Equipment | Industrial Automation
BENTLY NEVADA 350042M BENTLY NEVADA Speed acceleration BENTLY NEVADA Monitoring module, （New in stock,1 year warranty) CONTACT US: EMAIL:sales2@amikon.cn WEB:www.amikong.com SKYPE:ariatang111 MB(WHATSAPP):+86-18020776791 WECHAT:18020776791 ADVA
Industry News | 2010-10-07 14:49:04.0
A recently placed purchase order by the renowned Brazilian CERTI-Institute brought smiles on the faces of management and employees of ERSA. After successfully concluding the negotiations with the management of CERTI, ERSA was awarded a contract for delivery of production machinery and other equipment for the electronic production, valuing approximately 1, 2 Million €.
Industry News | 2020-06-29 15:50:27.0
"Day One: New Ways Set the Measure" the previous management of the SensoTech GmbH changed. Robert Benecke and Hannes Benecke are the new managing directors with immediate effect and supersede Dr. Ingo Benecke and Mathias Bode after 30 years.
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
Industry News | 2008-03-25 23:26:52.0
Comment from Mike Scimeca, President
Industry News | 2017-08-02 07:12:18.0
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:
IEC Electronics Corp.
Industry News | 2014-04-27 12:25:48.0
Metcal today announced that it has been awarded a 2014 EM Asia Innovation Award in the category of Rework & Repair Tools for its HCT2-120 Hot Air Pencil.
