Electronics Forum | Mon Nov 12 09:13:50 EST 2007 | russ
Chunks is right, reduce center pad by 50% print the signal pads at 1:1. this will ensure you solder QFNs fine regardless of the actual part. If you are not printing then it is process capability issue and has nothing to do with QFN but rathjer small
Electronics Forum | Fri Nov 16 18:08:32 EST 2007 | mika
So you are saying that 0.13 mm stencil thichknes and 20% reduction of the middle cooling pad is working for you? Just as I said.. Best Regards, Mika Ps. Keep in mind that the QFN is designed to do some heavy work, while enough "heat transfer" occur.
Electronics Forum | Sun Feb 24 15:24:48 EST 2008 | davef
With such a low standoff [eg, 1-2 thou of solder], we doubt that you can clean under QFN, either. For more, search the fine SMTnet Archives to find threads like http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=19247