Electronics Forum | Wed Apr 30 17:17:21 EDT 2003 | swagner
Since you mentioned voids I take it you are talking post reflow correct?
Electronics Forum | Fri Feb 25 09:30:29 EST 2011 | kahrpr
Was the void on the same pad for the 5 failures or were they random
Electronics Forum | Mon Aug 09 10:27:14 EDT 1999 | Tim Murphy
Just curious what effect pinholes and solder voids can have on solder joints that have high current passing thru them. Also could moisture from steam sterilization (autoclaving) get inside a said solder joint and then outgas during high current, and/
Electronics Forum | Thu Apr 17 14:14:17 EDT 2003 | davef
Takfire Questions are: * Why does your customer think the capacitor is the issue? [What are we thinking? Of course the capacitor is causing this voiding problem. What else could it be?] * What are the type, construction, end-cap material and plati
Electronics Forum | Fri Mar 02 08:52:20 EST 2001 | markkrmp
Are your voids looking like blow holes also? Is this only occurring on the solder joints of the Thru Hole components and Via's? Or does this happen on SMD pads? My experience is that we have seen this but only with some of our older PCB's which are
Electronics Forum | Thu Apr 17 22:20:39 EDT 2003 | davef
Q1: Industry standard detailing solder joint quality? A1: ANSI/J-STD-001 - Requirements For Soldered Electrical & Electronis Assemblies is the mutha of industry standard detailing solder joint quality.
Electronics Forum | Thu Mar 01 10:29:00 EST 2001 | davef
If the soldering process is not controlled, the results are variable, regardless of the flux type. Tell us more about your concerns, process, solder, etc
Electronics Forum | Tue Mar 19 09:29:08 EST 2002 | Basaran
What type of solder ball defect that you want to avoid is it voids or misregistration or ball-pad adhesion. Cemal Basaran
Electronics Forum | Tue Mar 06 03:29:05 EST 2001 | daled
Hello I am looking for any data that confirms the long term reliabilty of no clean paste as opposed to water soluable. Does anyone have any past experiences of problems when changing over from water soluable to no clean in the SMT prcocess?? Thanks i
Electronics Forum | Thu Apr 17 16:41:37 EDT 2003 | davef
60% ||||36% of ball area|| >36% ||Class2|| Accept|| Reject ||||45% of ball diameter|| >45% ||||20.25% of ball area|| >20.25% ||Class3|| Accept|| Reject ||||30% of ball diameter|| >30% ||||09% of ball area|| >09%
