Electronics Forum | Mon Nov 11 10:29:37 EST 2002 | Yannick
Hi, I'm beginnig working with BGA and with test I made I see some Void in it. I know that IPc have something on it. But I would appreciate if someone who have a good knowkledge about it contact me at: yb@m2s.ca Or can you give me some hint t
Electronics Forum | Mon Mar 15 10:43:06 EST 1999 | grevald
After switching from No-clean flux to Water soluble (Kester)we encountered voids problem (X-ray and microsectioning). Reducing the apperture sizes made the voids smaller but did not eliminate them. So we had to go back to No-clean. Any idea why voids
Electronics Forum | Fri Feb 25 04:28:49 EST 2000 | Sze-Pei LIM
We faced terrible void issue while using Sn96.5Ag3.5 solder paste, more than 20% void. We tried adjusting the reflow oven profiles but we did not have much success in reducing the void. Generally, we find quick preheat, high peak temp. and fast cooli
Electronics Forum | Fri Feb 25 04:28:49 EST 2000 | Sze-Pei LIM
We faced terrible void issue while using Sn96.5Ag3.5 solder paste, more than 20% void. We tried adjusting the reflow oven profiles but we did not have much success in reducing the void. Generally, we find quick preheat, high peak temp. and fast cooli
Electronics Forum | Wed Jan 14 23:08:19 EST 1998 | Ron Costa
Place your components directly on the PCB without using solder paste,unless your using high temp. solder spheres then you should use paste. If eutectic solder spheres are used try fluxing the BGA area and attach it directly to the board. This will re
Electronics Forum | Wed Aug 22 16:41:09 EDT 2018 | emeto
To all good suggestions I will add a few other thoughts: 1. Check PCB design(attached). THis mask clearance there is designed so you have some gas escape plan- verify if your PCB design follows that. 2. You can have a long soak reflow profile to re
Electronics Forum | Wed Nov 21 06:01:57 EST 2018 | premkumar_haribabu
Hi Davef, Thanks for your quick reply , just my inputs - we using 99.99 % pure nickel strip for soldeirng & when we do manual soldering this nickle stips its working well but when coming to SMT reflow even after high peak temperature ,its removes ev
Electronics Forum | Thu Feb 24 11:05:53 EST 2000 | Russ
I usuallly like to have the pad size the same size as the ball up to +2mil, the pcb solder mask opening to be +4 mil from the pad size (I have found this to aid in Xray inspection for opens since you can see the little tail of the solder wicking up t
Electronics Forum | Tue Feb 19 22:50:00 EST 2008 | amarpreet41
Do you of reducing hole size of DIMM connector will improve solder voids??
Electronics Forum | Tue May 02 07:46:39 EDT 2006 | Bob R.
Be careful about taking any generic advice and trying to use it to reduce voiding for your particular paste with your particular boards. I've done a few literature searches over the years on causes/cures for BGA voiding in the SnPb world and found a
