Electronics Forum | Tue Mar 13 18:25:45 EST 2001 | slthomas
Anyone doing a print-dispense-place-reflow process? I've never heard of it being done this way before today. Don't know why, actually, as it sounds like a fairly friendly method provided the adhesives used are happy with a standard reflow profile.
Electronics Forum | Mon Jun 11 10:40:46 EDT 2007 | ramseyn
Jim, Another good resource would be Asymtek (www.asymtek.com) I have had a lot of luck with their dispense equipment for underfilling applications. They have run tests in the past using various methods for our company to determine what type of epoxy
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
Electronics Forum | Fri Feb 18 09:06:33 EST 2005 | russ
This is what we use. 1. we only reball when we experience a manufacturing defect (short, trapped component, etc...)and if the part is expensive 2. No testing is done prior since we only reball parts that have a defective attachment. 4. The reliabi
Electronics Forum | Fri Apr 19 07:50:24 EDT 2002 | pjc
I used to build flash memory products for M-Systems. Up to 30,000 per week. Nothing special in the process for these boards. 1mm and 0.4mm thick std. FR4 PCBs are used. Double-Sided reflow. The 0.4mm thin boards require process carriers. Panelized 24
Electronics Forum | Fri Mar 28 00:56:50 EST 2003 | iman
we have a issue of post-reflow oven (SMT) soldering defects of blowholes and pinholes. Any suggestions or knowledge on root cause is appreciated to be share? BACKGROUND : we DI water wash and oven bake the PCB bareboards at 90deg-C for 60mins, to r
Electronics Forum | Wed Mar 14 17:33:42 EST 2001 | davef
Check Bob Willis' site. He calls this Single Side Multipass Endothermic Elongated Happy Reflow Soldering, er someting like that. Ha ha ha!!! Naw, he calls it Simultaneous Double-Sided Reflow Soldering. That might be something like you are talking
Electronics Forum | Fri Mar 28 09:44:11 EST 2003 | Claude_Couture
Your preheat temp seems excessive, what kind of solder paste do you use. can you try a max preheat temp of 140 degC? The reason for this is to let the solvents in the paste evaporate while keeping the activation of the flux for the very last moment b
Electronics Forum | Wed Feb 02 13:05:51 EST 2005 | russ
Process flow 1.Remove part - It may be necessary to bake assembly prior to removing. 2.Remove remaining solder from part 3.Apply flux to part 4.Apply solder spheres to part 5.Reflow part You may want to bake component before re-installing 6.Apply
Electronics Forum | Wed Jun 10 11:21:04 EDT 1998 | Kelly Morris
Does anyone have any info./studies on what the percentage or PPM defect rates are for each part of the typical SMT process. Example: Screen Print = 45% of total defects Component Placement = 25% of total defects
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