Electronics Forum | Mon Apr 07 11:53:44 EDT 2014 | hegemon
It's right there in front of you. Not enough overall temperature across the board. No wetting issue is evident, just looks like you need to turn up the heat, as Dave has mentioned. SOB has mentioned the issues surrounding the Electrolytic caps, ch
Electronics Forum | Fri Sep 21 10:44:34 EDT 2001 | slthomas
You can, and for small parts you probably won't see much difference between body temp. and lead temp. For QFPs or PLCCs there will be a much greater delta, though. I'd be more concerned with the small surface area you're making contact on (spherica
Electronics Forum | Mon May 24 16:45:44 EDT 2004 | Bob
BTU as well as most oven manufactuers have great products. If they fit what your looking for and can give you good support(preferably local) then you should not really see any quality problems with their products. With the oven max temperature of 300
Electronics Forum | Fri Dec 16 18:37:10 EST 2005 | mdemos1
Hi. I am trying to understand Tg and how it relates to reflow. With the higher temperatures of lead free, we have been looking toward laminates with a Tg of 180 instead of the current 140. My question is a little more general. In either lead free
Electronics Forum | Mon Mar 25 16:40:17 EDT 2013 | rrpowers
I have a customer that is wanting to use a low-temp solder paste such as SnBi for a lead free circuit, however they are specifying PET for the flex circuit. I have always used polyimide for SMT reflow due to the temperature limitations of polyester.
Electronics Forum | Mon Jul 10 04:16:03 EDT 2006 | dougs
Hi, We have a new product coming soon that has a fair number of PTH sockets and headers. I was thinking that it would be good to use intrusive reflow on some of them to even up cycle times between SMT and hand insertion, however, when i called t
Electronics Forum | Thu Aug 24 09:41:46 EDT 2000 | Dr. Ning-Cheng Lee
The optimal profile to choose is determined by the following factors, (1) thermal mass and distribution across the board, (2) reflow temperature range needed for a particular alloy, (3) the nature of flux. When the thermal mass is small, such as cell
Electronics Forum | Wed May 15 12:55:11 EDT 2002 | fmonette
Hi Dave, The short answer is "not any significant amount" of moisture is removed during reflow. The temperature excursion is much too short. If you look at the physics of moisture diffusion inside a package you will see that only the surface moist
Electronics Forum | Tue Jan 22 20:37:48 EST 2002 | davef
Try: * Searching the fine SMTnet Archives. We have ground profiling, thermocouple attach, etc. to pulps. * Buying [ http://www.ipc.org ] IPC-7530 - Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave)
Electronics Forum | Mon Aug 25 22:14:34 EDT 2003 | davef
You need a nylon with a heat deflection temperature [heat distortion temperature] - 0.45MPa ( C ) similar to your reflow peak. The HDT of the nylon in your connector is probably ~200*C. For more, look here http://www.tycoelectronics.com/environment
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