Electronics Forum | Thu Aug 03 11:39:19 EDT 2006 | slthomas
Is your squeegee cleaning process adequate to guarantee no transfer of paste residue between jobs? Personally I wouldn't risk it, but then again it's easy for me to say since we don't do lead free.
Electronics Forum | Tue Aug 08 06:13:44 EDT 2006 | spari77
hi, can anyone share experience on PCB open trace repair? we have some data that indicates that this repair is high risk and really very dependant on repairer skills. It may also cause reliability issue for trace repair. please advice.
Electronics Forum | Fri Aug 18 10:55:31 EDT 2006 | Chunks
Steve, You almost got yout Man Card revoked for stating: "determining the risks associated with simultaneously applying compressive and rotational forces to the end of the barrel". Luckily you bounced back with "chewing up the copper". Just pokin
Electronics Forum | Thu Sep 07 10:02:58 EDT 2006 | cyber_wolf
Doug, Could you please explain what you mean by "risk assessment on the secondary market". Thanks
Electronics Forum | Sun Dec 17 22:55:45 EST 2006 | foolat
I'd like to know how much capacitor offset from the pad should be acceptable? What are the risks of the placement offset if greater than the acceptable level? I'm still quite new to this so any help will be very much appreciated. Thanks
Electronics Forum | Thu Mar 08 17:35:19 EST 2007 | gregp
At the risk of being lambasted the Contact machines are very easy to program and have double the feeder capacity in a much smaller footprint. Please don't hate me.
Electronics Forum | Fri Mar 09 12:27:33 EST 2007 | coop
you might want to take a look at Genesolv it seemed to work well at my last job, but I am unsure about what the risk phrase is on this product.
Electronics Forum | Wed Dec 19 15:23:32 EST 2007 | arun2382
Hi, How do single pass and double pass stencil printing compare? Is one preferred to the other? Any risks associated with double pass stencil printing? thanks in advance -Arun
Electronics Forum | Fri Nov 28 11:52:57 EST 2008 | muse95
Wouldn't rubbing them on paper be a huge ESD risk? I agree with looking at the markings and checking the manufacturer web pages for info on identifying the markings.
Electronics Forum | Sat May 02 23:31:06 EDT 2009 | kareal
Thanks davef. The defect always occurred during UHAST reliability, but not find in reflow. The key is that there is tin diffuse to copper trace under solder mask. is it a "normal" board defect and what is the potential risk for device? thanks!
