Electronics Forum | Mon Dec 27 05:01:03 EST 2021 | jineshjpr
Hi JSeewald, You are very much right that there is difference between the solder pad with respect to IC pad. Since the Manufacturer suggests the same -- design also freezed to recommended dimensions.
Electronics Forum | Mon Dec 27 05:23:03 EST 2021 | jineshjpr
Hi Djo, very much sorry to say that no gbx file is available with me (Customer not yet supplied). Sharing you image of stencil design.
Electronics Forum | Mon Dec 06 10:32:35 EST 2021 | jineshjpr
Hi Everyone, Can you please suggest how to achieve 100% solder coverage of two Thermal pads on BRD1260C component..??? Surface finish is OSP Copper & Solder Paste is Sn/Pb 63/37. Component is Gullwing leads type. PCB having 1.60 mm Thickness.Peak Tem
Electronics Forum | Thu Jun 22 13:53:43 EDT 2006 | grantp
Hi, Yes, I agree, and it seems like these studies were designed to show that lead free soldering was better than lead based soldering, and they threw in some results of lead components soldered in a lead free process, which seemed about the same rel
