Electronics Forum | Mon Nov 27 17:50:01 EST 2000 | Dave F
Mike: It gets more humid in the winter? [I can see it�s true (not that I�d doubt you) cause I�m looking a a humidy map of the USA, right now] How does that work outin Californy? [Do the ocean breezes move the humid air in-land in the summer? Er w
Electronics Forum | Tue Dec 05 15:10:55 EST 2000 | Francois Monette
Victor, here are a few more elements of information to answer your question. Both the temperature and relative humidity on the manufacturing floor have a significant impact relative to the rate of diffusion of moisture inside a plastic package and t
Electronics Forum | Wed Jul 18 10:35:41 EDT 2007 | hussman
This seems like an odd request from an auditor. I can see an auditor requiring proof that you meet the J-Std, but verify? This would require you purposely damage product on a "before and after" scenario. As long as your manufacturing guideline say
Electronics Forum | Mon Nov 27 19:32:02 EST 2000 | Michael Parker
Prof. Whoopee - amazing facts that you find on your 3-D BB, it has completely confounded my comrade, Chumley. Plainly spoken that around the SF Bay Area a.k.a. Silicon Valley(ever hear of the famous SF Fog?)during the winter months, near the coast a
Electronics Forum | Fri Oct 22 11:53:53 EDT 2004 | C Lampron
Hi Christina, What would you be basing the yields off of? Is it solder defect, component placement, etc....? I have worked for a flex house for quite a few years. You are right. The Polyimide is very dimentionally unstable. (even more so on humid da
Electronics Forum | Mon Jun 20 10:59:18 EDT 2005 | Jason Fullerton
Extra cooling is better (Alpha recommends -3 to -7 degC/sec) for cosmetics. Less chance of s o called 'cooling lines' that look similar to 'cold' tin-lead joints. (Seems a bit steep to me - I worry about the risk of cracking ceramic caps.) Might be
Electronics Forum | Mon Nov 27 17:47:23 EST 2000 | Dave F
Gyver: Lemme take a wack [if you�ll excuse the expression, given direction of the later discussion] at your questions. Q1. Will the baking of BGA or PCB cause more oxidation before the SMT process? A1. It certainly will not cause less oxidation,
Electronics Forum | Thu Sep 19 11:14:45 EDT 2002 | Jim M.
We had lots of problems with bridging on 15.8mm pitch, QFP17-160 at the start.The board was .032 thick, double sided-six boards to a panel. Here is the problems (not neccessarily in the biggest to little but as i remember them) and solutions that he
Electronics Forum | Tue Oct 07 10:23:35 EDT 2014 | reballer
I have been applying solder spheres to BGA packages. During the process, the spheres are run over a stencil for placement. The spheres tend to stick to each other (and clump), even away from the stencil pattern, when it is humid in the work area. I'm
Electronics Forum | Thu Jun 06 09:46:28 EDT 2002 | davef
Most paste supplier recommendations seem to work fine in the locale of the printer. Search the fine SMTnet Archives for recommendations on the range of control for temperature and humidity in a assembly shop.
