Electronics Forum: samples (Page 5 of 94)

ESD Smocks

Electronics Forum | Fri Sep 17 01:19:02 EDT 2010 | sachu_70

I suggest you have a look at the method and detergents used during cleaning / washing these smocks. This would help to understand if the smock properties deteriorated on account of such process. In addition, you could keep one unused sample for over

Testing for hard gold

Electronics Forum | Wed Jul 31 18:26:09 EDT 2013 | Jeff Kennedy

You might consider to contact a lab to Run a microindenter against a know good soft gold sample. The knoop value for the soft gold will be much lower than for hard gold. This would be reflected in the diameter measurement of the indented samples.Smal

Dimensional Stability

Electronics Forum | Thu Aug 03 10:12:31 EDT 2017 | bspoon

DCS testing has detected exotherming in samples of stock FR4 laminate material. The exotherming subsequently disappears from the heat flow plots when DSC testing is repeated a second time on the same samples. Can this non/ under-cured material cause

soldermask color change around vias

Electronics Forum | Fri Jun 07 11:10:08 EDT 2019 | teejsd

We also have a Foresite C3 for spot testing for ionic contamination. I didn't use it at this spot, but used it some other spots around the PCB that showed this color change and with our C3 we were passing IPC standard for ionics. But I was wonderin

Re: Coplanarity Measurement Machine

Electronics Forum | Wed Oct 27 17:10:14 EDT 1999 | Jerry Stafford

Guys, I am not really looking for an automatic system. I am looking for as automated a system as I can get for $30K or less. I would really prefer something under $10K. I just need a way to sample devices to see if the vendor is meeting my coplana

Re: BGA Warp

Electronics Forum | Wed Sep 29 07:28:04 EDT 1999 | Wolfgang Busko

3�C/min) or maximum temperature (~240-250�C)." For the correct handling of moisture sensitive devices and prebaking advices see IPC-SM-786A or newer publikations. I encountered the following: A tray of sample BGAs was send to me proper packed and se

DPMO's

Electronics Forum | Mon Mar 01 09:14:00 EST 1999 | Jules Winfield

| I'm trying to get a feel for what the industry is doing with regards to collecting assembly defect data in the SMT/PWA process. Is it sampling or 100%? What are the points within the process where critical assembly defect data is collected. We run

Ionic Contaminate Testing (time or auto terminate)

Electronics Forum | Thu Sep 02 16:12:51 EDT 2004 | Mike Konrad

Hi -K We are a manufacturer of ionic contamination testers (not yours). In most cases, automatic mode is appropriate. In some instances however, you may need extra time to �release� entrapped contamination from the sample. Automatic mode is not a

solder paste measurement machine

Electronics Forum | Thu Apr 26 10:07:06 EDT 2007 | realchunks

Hi Dub J, I have worked for a few companies that did 3D sampling and found the data they produce to be useless. In the real world they are slow, so that means you won't sample every board. Now if you're not sampling every board, and you start to r

How to define solder paste printing height tolerance

Electronics Forum | Mon May 07 16:07:05 EDT 2012 | davef

Start with targets based on the stencil thickness (for height) and stencil thickness times the aperture size (for volume). * Set reasonable upper and lower control limits (+ 25% and –25 % of the targets, for example). * Next, check the printer set-u


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