Electronics Forum | Tue Sep 18 01:41:23 EDT 2001 | shvetangcd
Hi Jeff, We are having solder-short problems for BGA, QFP, and some other fine pitch parts while using DEK screen printers. The PCB is processed on the second half of the line for screening the side with BGA, QFP, and other fine pitch parts. Which m
Electronics Forum | Fri Nov 14 17:15:54 EST 2014 | tombstonesmt
Are you experiencing the solder balls on the opposite side of connector insertion or same side? If it's the same side as connector insertion how many strokes are you using at? We've experienced a few issues with pin in paste, everything points back
Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin
| | | | | Hi, | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | |
Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Tue Jul 13 14:25:57 EDT 1999 | Earl Moon
| | | | Hi, | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | |
Electronics Forum | Thu Jul 15 14:38:38 EDT 1999 | JohnW
| | | | | | Hi, | | | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)
Electronics Forum | Thu Jan 26 02:14:52 EST 2017 | jgo
Hi all, Am new to SMT here. I have a very thin laminate substrate which around 120um thickess. Being that thin, warpage is constantly an issue for us. For the solder printing part, we have a number of problems. Being so thin and warped, we need t
Electronics Forum | Mon Jan 30 05:58:39 EST 2017 | rob
Hi all, > > Am new to SMT here. > > I have a very > thin laminate substrate which around 120um > thickess. Being that thin, warpage is constantly > an issue for us. > > For the solder printing part, > we have a number of problems. > > Being s
Electronics Forum | Wed Nov 23 09:38:52 EST 2011 | blnorman
More agreement with screen print adhesives. Back in a former life time we did do pin transfer on one of our product lines. If you had to go with pins, make sure your adhesive rheology is suited for it. Different adhesives are designed for specific
Electronics Forum | Wed Nov 23 07:30:44 EST 2011 | scottp
Are you stuck with pin transfer for some reason? Screen printing is more repeatable and easier to maintain.
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