Electronics Forum | Tue Dec 28 15:12:03 EST 1999 | Bill Schreiber
Rick, Ultrasonics is a mechanical scrubbing action (cavitation) similar to any other scrubbing action, if you scrub long enough, you stand the chance of wearing away some of the surface material (shiny coating of a solder joint). The shiny coat on a
Electronics Forum | Mon Apr 22 20:55:00 EDT 2002 | ianchan
Hi, this is not really a technical solution, just a feedback. we too have a model series using the same WS paste type. it gives a dull solder joint with white residue that can be marginally removed after post-DI water rinse (ie. not 100% removed).
Electronics Forum | Tue Mar 15 09:46:06 EST 2005 | davef
Comments are: * J-STD-001 and A-610 committees have eliminated the requirement that solder joints be "bright and shiny". Certain metallizations (such as gold) can influence the solder joint surface texture, but have no impact of reliability. Reliance
Electronics Forum | Fri May 14 00:34:22 EDT 1999 | Mike D.
| I need some pics or documentation on how a finish soldered joint looks like for SMT component. I have various people who supposedly says has knowledge with High Temp says my joint could look better. The joint looks shiny and great except for a grai
Electronics Forum | Wed Sep 30 04:36:54 EDT 1998 | Jacqueline Coia
Still cant get a fix to SMD soldering problems, Joints still look strong shiny and well wetted, although when pulled lead still coming away from pad, leaving a dull grainy looking space. This is occuring just after reflow (convection), no other proc
Electronics Forum | Tue Dec 10 19:30:49 EST 2002 | Vijay
Hi Dave, The peak temp on the leads is 216-218 Deg C and duration above MP (179 degC) is 55-60 sec. Alloy(solder paste) used 62 Sn,36 Pb 2Ag (Alpha WS 609 Ty 3 Water eash) This is a SMT connector wth Gulwing leads Gold plating on the PCB is 2-5 micr
Electronics Forum | Wed Feb 08 03:44:28 EST 2006 | fctassembly
Hello Amol, I continue to be amazed at the surprise engineers have on discovering that a non-eutectic alloy such as SAC305 displays micro-cracking and rough joints in a soldering process. There was a reason the electronics industry chose to use eutec
Electronics Forum | Tue Mar 15 17:58:56 EST 2005 | darby
Mat, Are you sure you should be using SnPb HASL boards if you are doing prep for lead free? If you aren't actually going to comply with RoHS then fire away. Nearly all of our assemblies are now ENIG and as any re-design comes up on a HASL board it is
Electronics Forum | Fri Jun 12 06:53:54 EDT 1998 | Earl Moon
| I am looking at purchaseing a full convection bench top oven from OK Industrys. (Model JEM-310) | It seems to have all the features that we will need for low volume production runs. | It has a Nitrogen input option, and I am intrested if anyone on
Electronics Forum | Wed Aug 10 09:01:15 EDT 2005 | fctassembly
Hello Joseph, Sorry for the bad news but microcracking is a well known potential condition occuring with the SAC305 alloy. Microcracking is a condition being seen with many joints soldered with the SAC305 alloy. It is technically a shrinkage cavity
