Electronics Forum | Thu Jan 10 06:04:13 EST 2002 | Matt Kehoe
Thanks for the suggestion. We got the machine up and running yesterday morning. Turned out to be a power supply to the boards that control heaters and rails/conveyor. She ran great all day and hopefully will be a "hapy oven" from now on. Thanks a
Electronics Forum | Wed Jan 26 06:40:17 EST 2005 | mattkehoe
You can place them by hand and reflow them using a toaster oven if you use SIPAD ssd with adhesive flux. Yes, I said a toaster oven. It is being done!! Convection ovens work best. Give me a call and I will send you some sample boards to try it out
Electronics Forum | Tue May 31 09:40:23 EDT 2005 | mattkehoe
We have some boards that exhibit poor solder wetting when reflowed. Nothing fancy, smallest pitch size .050. See photo's at http://www.sipad.net/SnPbwetting.htm Is this ; Contamination on the HASL finish? Insufficient solder,not enough to cover pad
Electronics Forum | Wed Feb 07 07:36:11 EST 2007 | jax
mk, Should I read into the fact that you posted this on a sipad website? You could always add an etch process to you stencil design to gasket around the raised mask locations. It is currently done when additive etch's/trace's are used. The extra $20
Electronics Forum | Fri Nov 16 08:10:56 EST 2001 | Matt Kehoe
Hi Dave. Sorry I have not responded. Just as I was getting into this forum activity the company I worked for (past tense) decided not to re join the SMTA and I was cut off. Anyways, you can find most of what you asked for about SIPAD on the Midwest
Electronics Forum | Tue Jun 28 16:41:07 EDT 2005 | mattkehoe
Yes, .062 fr4. Like I said before, we run a lot of gold boards, as many as 25% of what goes through the shop, and we've never adjusted anything before??? Many of these are bigger by 2 X and much more dense. Reflow is not as shiny as HASL but always u
Electronics Forum | Tue Aug 03 09:47:39 EDT 2004 | AJ
Hi All, I have a question for everyone regarding SSD - Solid Solder Deposit. I have read many good articles on this "new" process and was wondering why it has not caught on. It is better known in the US as SIPAD or Precision Pad Technology. Here is
Electronics Forum | Tue Jul 11 12:59:26 EDT 2006 | mattkehoe@sipad.com
We are trying to apply solder to boards with 80 microinches of electro plated hard gold. No components involved, just print 63/37 paste and reflow. The results are very poor on some boards, not so bad on others? Pictures at http://www.sipad.net/thick
Electronics Forum | Fri Sep 14 09:30:29 EDT 2007 | russ
That is inherent issue with lead free, you may want to ask your customer to reconsider this specification, It was probably initiated during the pb days when an exposed pad could signify a reflow issue. Overprinting will give you solderballs and unle
Electronics Forum | Sat Jun 27 10:10:23 EDT 2009 | ysutariya
I'm not in assembly, but I do know of a technology called Sipad if you are only looking to do small batches. They pre-apply the solderpaste to boards with a light adhesive, which allows you to hand-place components, even micro BGA's and fine-pitch Q
