Electronics Forum: small components (Page 5 of 89)

Baking components at 70 degree

Electronics Forum | Mon Jan 07 13:09:35 EST 2008 | stevek

As I told you, some carriers (trays) are limited > to 75 degree maximum, and from time to time > employees do not pay attention to this. This is > one of the reasons. The second reason is that 90 > degree still be problematic in a case of rebake

Kester R562 and using lead free components

Electronics Forum | Fri Jul 06 12:11:34 EDT 2007 | james

We are starting to see issues with using Kester WS R562 with lead free components. The joints look grainy on almost all of the 0402'2 and other small components. Some of the solder does not solder to the terminations. These are hybrid boards which

Pb-Free solder alloying with finish on components

Electronics Forum | Tue Aug 22 09:49:39 EDT 2000 | galltp

Dr. Lee, We have seen a small decrease in shear strength for Pb/Sn plated components attached with Sn/Ag/Cu solder compared to components with a Pb-free finish. With the jump in the cost of Pd, we are struggling to define a practical Pb-free

Is anyone using FEEDER FINGERS for small cut tape SMT parts?

Electronics Forum | Tue Jun 11 09:31:13 EDT 2019 | relaycz

Very cheap option are adhesive strips. Easy to use and if operator is carefull, there are no spilled components. https://www.steier.de/steierform/Anwendungen/Gurte-verbinden-SMD-Splice-Produkte/TOP-Splice-ESD-gerecht-orange.html

How to stop components moving on nozzle

Electronics Forum | Fri Apr 20 13:04:51 EDT 2018 | dleeper

Have you tried using a larger nozzle? If the selected nozzle is too small, it won't provide enough force to hold the part in place. What kind of part are you having trouble with?

placement of 8 ml smt components

Electronics Forum | Thu Sep 10 12:32:31 EDT 1998 | Tim Scully

Heeeelllllp. I am a sales rep. ( I know I know, you can't help me with that. ha ha.) Actually, I represent a company that fabricates PCBs and assembles them under the same roof. We are a small to moderate volume house that is just getting into su

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 12:35:56 EDT 2002 | stepheno

Fourth - > back to design of PCB. Are there solder dams of > mask between the pads? If yes, that helps. If > not, pay close attention to stencil aperture > width and be sure that the aperture deposits less > paste by 1-2 mils per pad, centered o

Re: placement of 8 ml smt components

Electronics Forum | Fri Sep 11 09:30:30 EDT 1998 | Earl Moon

| Heeeelllllp. | I am a sales rep. ( I know I know, you can't help me with that. ha ha.) Actually, I represent a company that fabricates PCBs and assembles them under the same roof. We are a small to moderate volume house that is just getting int

Re: placement of 8 ml smt components

Electronics Forum | Thu Sep 10 15:29:15 EDT 1998 | matthew park

Tim, What is it? Which ones are you talking about: 0.080" vs 0.008", 0.100" vs 0.010", or 0.050" vs 0.005" pitch devices . If you are saying 0.080",0.100" and 0.050", any pick and place machine can handle that. Well if not, one machine that is ca

Solder Balls at component side around Pin in Paste components

Electronics Forum | Sat Nov 15 05:08:45 EST 2014 | grimus

Same side (component side) if You give me e-mail I can provide You more pictures. I'm making one stroke with same speed (I'm using closed proflow head and DEK printer). 5 mils thickness stencil. Products requirement - 3 IPC Class (75 % and more fill


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