Electronics Forum | Mon May 17 02:06:57 EDT 2004 | johnwnz
Look here: _a class=roll > href="http://www.aimsolder.com/techarticles/tech%2 > 0sheet%20BGA%20voiding-%20reducing%20through%20pro > cess%20optimization.pdf" > target="_blank"_http://www.aimsolder.com/techartic > les/tech%20sheet%20BGA%20voidin
Electronics Forum | Sat Aug 21 12:38:09 EDT 1999 | Earl Moon
| Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | Anyone working on this , please help out. | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went through prototypi
Electronics Forum | Fri Jan 16 07:06:47 EST 2004 | Mika
Component manufacturer often have recommendation for pad layout and process setup. This should be used as a guideline to help You to set up the process. Exactly what type of component is this, uBGA? We populate 64 I/O uBGA's on our pcb's with 0.3 mm
Electronics Forum | Wed Feb 17 12:16:17 EST 2010 | dcell_1t
Hi there: During the past weeks (let's say since beginning of the year) we've been experiencing some issues with shifted components. We verify for position before Reflow oven and the components are Ok, but they observe shifted after reflow. it occurs
Electronics Forum | Mon Dec 25 08:43:35 EST 2017 | arjunkolavara
Hi , We are having Pin hole issues on the passive locations in the board after the SMT reflow process. Details: PCB surface Finish : ENIG . Solder paste : Alpha OM338 – M13 / Indium SMQ92J Location : Its Random and more on passive components. {
Electronics Forum | Wed Apr 09 17:39:30 EDT 2008 | diesel_1t
Hi. I know that this is one of the mos common threads here, I have been doing some research, but i didn't find any similar. The main issue is that I have seen tombstoning since two weeks ago, it is more characteristic on 0603 resistors (Stackpole e
Electronics Forum | Sat Aug 21 17:10:12 EDT 1999 | K. Vikas Sharma
| | Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | | Anyone working on this , please help out. | | | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went through p
Electronics Forum | Sun Aug 22 08:21:39 EDT 1999 | Earl Moon
| | | Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | | | Anyone working on this , please help out. | | | | | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went t
Electronics Forum | Mon Feb 20 20:57:35 EST 2006 | Cal Kolokoy
The ramp sets the stage for flux activation, and if ramping in a linear fashion, burning off some of the volatiles, but yet preserving the activators. The ramp is also intended to preheat the SMDs to prevent thermal shock. Most solder paste data sh
Electronics Forum | Tue Mar 06 15:59:33 EST 2007 | pima
hello I would like to ask you for advise. I have problem with one of my SMT line and skewed parts at the end of line after reflow. My line is composed: DEK, 3d visual inspection of paste printing, IP3, 8 zones reflow oven. I m builidng there produc
