Electronics Forum | Tue Sep 29 10:53:42 EDT 2015 | marlyn
Hey there fellow people with SMT issues... What's the proper procedure for soldering through-hole headers on the back-side of the PCB (pins poking out on same side as SMT parts)? ( Yes - I did the SMT side first and am now faced with LOTS of pin-poin
Electronics Forum | Fri Dec 08 21:26:44 EST 2006 | billwestiet
You already have some good answers. A chemical isolation zone for RMA is a good idea. If you are looking for new see the two references you have and Austin America. If you are looking for used, see us at http://www.ietechnology.net. We presently
Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
Electronics Forum | Thu Nov 12 23:09:30 EST 1998 | Lynn Lai
I want to find information about SMT and PCB: Process Manufacturing How it work
Electronics Forum | Tue Dec 13 17:41:04 EST 2011 | davef
A Study Of 0201’s And Tombstoning In Lead-Free Systems, Phase II Comparison Of Final Finishes And Solder Paste Formulations http://sheaengineering.com/Documents/APEX%2008%200201s%20and%20Tombstoning%20phase%202%20paper.pdf CONCLUSION The condition
Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef
Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem
Electronics Forum | Mon Mar 03 13:18:02 EST 2003 | msivigny
Hello phil, The use of AOI systems give us the opportunity to auto-collect defect information much the way you're using them now. AOI systems become extremely effective when the collected data is used to perform some positive change into the process.
Electronics Forum | Thu Oct 01 13:33:01 EDT 2015 | marlyn
Hey there fellow people with SMT > issues... What's the proper procedure for > soldering through-hole headers on the back-side > of the PCB (pins poking out on same side as SMT > parts)? ( Yes - I did the SMT side first and am > now faced with L
Electronics Forum | Sat Mar 05 22:57:32 EST 2005 | gpaelmo
This has been our practice and its worked well: SMT process-QC/Touch-Up-Assembly. We have dedicated QC/T-Up after reflow trained under IPC requirements. They do the SMT inspection and ONLY touch-up if necessary. This way we never have to inspect SMT
Electronics Forum | Sun May 28 23:01:31 EDT 2006 | jacksaria
Hello to all, We are encountered many problems/defects in SMT lines.I would like to know your suggestion or recommendation for SMT optimization and improvement. What are the step by step solutions in order to optimized and to improve the printer, pi
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