Industry News | 2017-08-10 17:43:56.0
Nihon Superior Co. announces its Nihon Superior Shanghai subsidiary will exhibit in Booth #1G08 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. The reliability of SN100C has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305.
Industry News | 2008-04-07 22:33:54.0
OSAKA, JAPAN � March 31, 2008 � Nihon Superior Co. Ltd., an advanced lead-free soldering materials to the global electronics industry announces that it has been awarded two 2008 NPI Awards with the Balver Zinn Balver Zinn Group (Balver Zinn, Nihon Superior Co. Ltd., FCT Assembly and DKL Metals) in the category of Soldering Materials and Flux for its innovative SN100C Paste. The awards were presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008.
Industry News | 2014-08-26 16:19:51.0
Nihon Superior Co. Ltd. will exhibit in Booth #410 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2019-01-04 16:38:36.0
Nihon Superior today announced plans to exhibit in Booth #1334 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29 - 31, 2019 at the San Diego Convention Center in Ca. The company will celebrate the achievements produced by the well-known SN100C® lead-free alloy. SN100C (032) flux-cored solder wire will be introduced and SN100CVTM P608 D4 solder paste will be shown.
Industry News | 2008-10-07 20:52:28.0
OSAKA, JAPAN � October 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., an advanced soldering supplier to the worldwide market, announces that it will feature a newly expanded range of SN100C products, which includes new halogen-free solder paste, in booth 402 at the upcoming Mexitr�nica exhibition, scheduled to take place October 21-23, 2008 at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, M�xico.
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Industry News | 2015-01-27 10:59:31.0
The Balver Zinn Group announces that Cobar Solder Products Inc. is sponsoring the fourth annual IPC APEX EXPO® Hand Soldering Competition, scheduled to take place Feb. 26, 2015 at the San Diego Convention Center in San Diego, CA. Cobar Solder Products is contributing Balver Zinn’s BRILLIANT B2012 SAC305 (SN97C) solder wire is halide-free, rosin-based and designed for manual and robotic soldering.
Industry News | 2017-11-03 09:46:42.0
The Balver Zinn Group announced that they will be sponsoring the IPC Hand Soldering Competition (IPC-HSC) scheduled to take place November 14-16, 2017 at Productronica - New Munich Trade Fair Centre in Munich, Germany. Balver Zinn will be providing BRILLIANT B2012 SAC305 (SN97C) solder wire which is halide-free, rosin based and designed for manual and robotic soldering.
Industry News | 2009-04-08 23:28:50.0
OSAKA, JAPAN � April 2009 � Nihon Superior Co. Ltd. announces that it has been awarded a 2009 SMT VISION Award in the category of Environmentally Friendly Products & Services for its SN100C P600 D4 Solder Paste. The award was presented to the company during a Monday, March 30, 2009 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2009.
Industry News | 2009-12-07 19:30:01.0
OSAKA, JAPAN — October 2009 — Nihon Superior Co. Ltd. announces that it will debut its SMT VISION Award winning SN100C P600 D4 Solder Paste in Hall A4, Stand 570 at Productronica. The event is scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.
