Electronics Forum | Wed Nov 06 15:47:49 EST 2002 | bpan
Hello All, Having a problem during reflow and would like your opinions. We are using Kester r562 water soluble paste and I am using a Kic 2000 profiler in a 4 zone oven (top only). We are seeing poor wetting or fillets that are not "passable" per IPC
Electronics Forum | Thu Jun 21 07:21:26 EDT 2007 | chrispy1963
5 mil is perfect for 0402's. If you are printing SnPb solder use apeture reduction such as home plating the pads. However, if youre using SAC, we've found that printing the entire pad works best due to poor wetting compared to SnPb paste. Chris
Electronics Forum | Wed May 24 16:40:40 EDT 2006 | samir
Yikes! Sounds like a hairy situation there. I've successfully collapsed a Pb-Free BGA (using a Sn/Pb solder paste), with a peak temperature of 220 Deg. C and Time Above SAC's Eutetic point (217) of 17 seconds. Beware of overcooking your smaller ma
Electronics Forum | Thu Apr 19 16:54:32 EDT 2007 | flipit
I don't suggest using Pd/Ag or Ag/Pd terminated components unless you are forced to use them. You often see a line of demarcation that suggests a poorly wetted solder joint. I have had bad experiences with Pd/Ag terminated capacitors. Even when so
Electronics Forum | Fri May 03 06:03:26 EDT 2002 | geoff_goring
Dave Many thanks for your very informative piece on SMT.com As we stand we have not yet 'seen' any problem. My issue is that we have ordered (LTB) a very large quantity of ASICS and our usage has taken a down-turn. We therefore need to keep the one
Electronics Forum | Wed Jun 22 09:12:57 EDT 2005 | bsudak
Our manufacturing site has been struggling with soldering Alloy 42 TSOPs. Currently, we have to hand solder in one of our applications. Here are the particulars. Component: 54 leads, Sn plated, 400microinches +/-200. Process: Eutectic 63/37 Sn/Pb
Electronics Forum | Mon Mar 29 11:48:43 EDT 2010 | davef
SAC BGA In A Sn/Pb Reflow Process Conclusion: Area array components (ball grid arrays, chip scale packages, flip chip packages) with Pbfree solder sphere alloys should not be reflowed using a tin/lead reflow profile due to the resulting non-uniform s
Electronics Forum | Wed Oct 19 22:48:18 EDT 2016 | thaneshsivanadian
Hi All, Currently im seeing a cold solder/ poor wetting underneath the BGA Ball as i shown in the attachment. From the attachment you also can see one ball with poor wetting and another ball with a good wetting. When i checked with my re-flow profil
Electronics Forum | Tue Aug 24 14:49:58 EDT 2004 | jamyboy
Hi, I am trying to assemble a LTCC component > with Pd/Ag surface finish on to Sn/Pb/Ag solder > and Sn/Ag/Cu solder. I am passing it through a > reflow. I have observed poor wettability at the > solder-pad joint. Does anyone have information
Electronics Forum | Thu Jul 22 22:18:12 EDT 2004 | davef
Notes from an AIM No-Lead Presentation ... Wave Soldering * May require a higher pot temperature than tin/lead: 255-265*C * May require a change in liquid fluxes to compensate for the poor wetting of some alloys and high thermal stresses of the wave
