Electronics Forum | Thu Oct 28 17:46:44 EDT 1999 | Gary Kemp
My company manufactures memory modules and I'm finding solder specs on the gold fingers following the reflow process. We are using a no-clean solder paste. The spec sheet warns against crossing the 140 degree C mark during the soak stage, preventin
Electronics Forum | Fri May 21 10:16:31 EDT 1999 | Parvez
Dave, i tried reflowing bare boards with only solder printed on em and no component placed. we still got voids as same as when components were placed. so atleast one of that theories(voids due to component/component placement)could be considered to b
Electronics Forum | Wed Jun 03 08:46:32 EDT 1998 | Ryan Jennens
Thanks everybody for the help! We are still working on the bottom side, but the top side solder balling seems to have gone away for now. We flattened out the middle soak zone of the profile, so that rather than an even ramp up, the board heats quick
Electronics Forum | Wed Jun 25 12:20:03 EDT 2003 | russ
This may make it easy, Do you really need soak? Or can you just ramp to reflow. Most pastes that I am aware of perform just as well using the linear ramp as opposed to the ramp/soak /spike. Now, out of curiosity how are you attaching the thermocou
Electronics Forum | Thu Mar 09 16:14:19 EST 2006 | marc
CGO Assuming your system is performing well here are a few ideas to help out your profile.... - Pull the material spec and ensure you are meeting the requirements for times and temp. Many times the material will allow a mild soak of the board prior
Electronics Forum | Fri Sep 08 11:29:40 EDT 2006 | GPP
James, What type of profile are you using. Ramp-to-Spike, Ramp-Short Soak-Spike, or Long-Low Spike? I had a similar problem in a past life - random skews on chip components - and got rid of it by converting to Ramp-to-Spike (the old profile was R
Electronics Forum | Tue Sep 11 04:45:25 EDT 2007 | pavel_murtishev
Good afternoon, Oops. Quite huge difference I must say. But you should try to tweak your profile anyway. First of all try to enlarge soak time as Mr. RDR has said. What process type do you use? Lead or lead-free? By the way, there are lead-free proc
Electronics Forum | Mon Aug 18 17:15:15 EDT 2008 | jlawson
This can be seen on leaded soldering also as well as LF (worse with LF). To reduce this you can look at your stencil and profile. Printing a cross-hatch deposit can reduce the voiding as it allow gasses to release when in reflow - thats the theory
Electronics Forum | Fri Aug 28 05:07:59 EDT 2009 | sachu_70
Do you clean the stencil manually or using the automated under-stencil cleaner on your Printer (recommended)? 1. Ensure that stencil wipes are lint-free and soaked sufficiently with solvent before use. 2. If your printer supports automated cleaning
Electronics Forum | Wed Feb 14 02:06:05 EST 2018 | ameenullakhan
Hi Evitmov, Thanks for your valuable suggestion. we have used RTS profile. And profiles with an average soak and reflow time.:( Those profile didn't help us so much. It at later stage we have adopted to this hot soak profile. There is one partic
