Electronics Forum | Fri Feb 19 14:43:46 EST 1999 | Nithy
We are in the process of getting into no-clean paste and fluxes. One important issue in this is sodler balling. I have heard some people say that having a matte finish would help in having lesser solder balls and that the solder balls would not be
Electronics Forum | Thu Jun 27 21:28:42 EDT 2002 | davef
You're correct that the Ni/Pd termination seems to have something to do with you solder balling. It could be related to the interaction between your paste and the Pd. I assume these are really 'fines' rather than 'balls'. Things that come to mind a
Electronics Forum | Mon Dec 17 02:08:21 EST 2007 | mun4o
Hi, I have a lot of solder bridge in our wave soldering process.We use SACX0307 and Surf 11 flux.the SW mashine is Vitronics delta 6622.Itry to change flux and termoprofile but results is not god.Can you halp me - recommend me some flux or other adv
Electronics Forum | Mon Dec 17 15:41:15 EST 2007 | shrek
Ha-ha-ha-ha-ha,me lad. Wave solder is like an onion, it's got many many layers. Kind of like me-self. I'm a big ogre with many complex layers. At any rate i like the other colleague with his adverstising trigger finger. by golly, me chap, he's a
Electronics Forum | Tue Feb 17 18:17:28 EST 1998 | John Wilson
I am looking for any information or testing data done on the amount of weight that can be held by a bga package based on size of the solder sphere and number of spheres. I am reflowing components with a bga package on the opposite side and looking f
Electronics Forum | Mon Dec 17 14:16:44 EST 2007 | realchunks
This is funny. Poeple giving answers to a question that isn't specific. What if the shorts he is having are on the top of his board, caused by flooding or Omega wave too high?
Electronics Forum | Wed Jun 21 09:12:42 EDT 2017 | emeto
I would start with checking the flux amount and trace and the thermal profile(preheating is important) for this assembly. Then I would consider changing to another flux and run it again.
Electronics Forum | Sat Jun 24 07:48:05 EDT 2017 | ranap121212
Thanks from your answer. A few days ago the supplier told me about these rolls. Now I am waiting for them and I will make tests. Maybe I will also try to reduce the ejection speed but this will lengthen the process
Electronics Forum | Mon Dec 17 12:06:58 EST 2007 | pjc
5 Steps to Eliminate Bridges: 1. Establish (wave) Parallelism First and foremost, you must establish board-to-wave parallelism. This is the prerequisite to any wave solder process control. For an understanding of the power of this approach go to ht
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
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