Electronics Forum: solder and volume and spi (Page 5 of 7)

Re: CuOSP and IMM Silver versus HASL

Electronics Forum | Thu Aug 31 18:59:55 EDT 2000 | Brian W.

Our customers use OSP, HASL, immersion tin and immersion gold as board finishes. If I recommend a finish to the customer, it is one of the immersion finishes or OSP. Those finishes have the advantage of a flat surface to deposit paste. HASL has va

ultra low cost pick and place?

Electronics Forum | Sat Jun 12 19:48:47 EDT 2010 | bootstrap

I like what you're doing. 20 years ago anyone, hobbyists and tiny garage-shop companies could create electronics devices just as sophisticated and cool as big corporations. Today, SMT has largely trashed the creativity (and competition) that existe

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Tue Jul 13 10:26:38 EDT 1999 | HST-SE

| | Hi, | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | Secondly, I n

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Fri Jul 16 03:11:23 EDT 1999 | SPEZZAFERRI Luca

| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW

| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Tue Jul 13 14:25:57 EDT 1999 | Earl Moon

| | | | Hi, | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | |

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin

| | | | | Hi, | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | |

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Thu Jul 15 14:38:38 EDT 1999 | JohnW

| | | | | | Hi, | | | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)

Re: Standard pad sizes for reflow and wave

Electronics Forum | Tue Sep 07 09:11:33 EDT 1999 | Dave F

| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes

Programming for Pick & Place and AOI machines

Electronics Forum | Mon Jul 31 15:16:43 EDT 2017 | emeto

John, contemporary machines provide their own software for programming - most you can do completely offline. There are several tricks here: 1. Design libraries correctly - you should have polarity convention that matches your P&P and your AOI machi


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