Electronics Forum | Sat Jun 27 02:15:33 EDT 2020 | indhu
Hi Victor, The part drop after the first side reflow itself. The part seems like didn't catch solder.
Electronics Forum | Wed Jun 26 14:33:52 EDT 2019 | slthomas
Do you have any images that show the soldered terminations? Also images of the pcb terminations after the part has moved might be helpful.
Electronics Forum | Wed Jun 26 23:35:55 EDT 2019 | anhsang38
There are some pictures of solder and pcb terminal after part has moved. https://ibb.co/5hKBxXX https://ibb.co/Kw27cns https://ibb.co/HtKBMdW Rg Sang
Electronics Forum | Wed Apr 08 07:49:25 EDT 2009 | davef
We don't view this as "board delamination." It looks more like "solder mask bubbling." It may be the picture. Please describe the issue or enclude additional pictures.
Electronics Forum | Thu Apr 16 11:58:20 EDT 2009 | ccross
We have seen this exact same problem. Our vendor agreed it was their problem and also agreed it was a moisture issue within the PCB layers, not the solder mask. We have taken to baking our boards, especially when they are manufactured during the late
Electronics Forum | Mon Feb 07 12:47:18 EST 2005 | Indy
1. use 6-7mils stencil. 2. reduce aperture opening to 60-70% of pad size. 3. check viscosity of solder paste. According to that you might want to alter your print speed and pressure. Cheers Indy
Electronics Forum | Wed Apr 08 08:21:48 EDT 2009 | 1036
push the "bubling" and it springs back. It does not look like solder mask. We may have to fight with board house as they don't think it's their problem. Do you know any way to find the real reason? Any idea or help will be appreciated.
Electronics Forum | Thu Jun 27 08:12:17 EDT 2019 | SMTA-John
If the case shield is solderable, add pads to the edge of the two through holes and paste . This wetting should hold it in place.
Electronics Forum | Wed Oct 19 07:04:06 EDT 2022 | winston_one
If any changes in design is not possible and you have to solder it, it's a real headache, I know... I see only 3 options here that you can try consiquently: 1) Accurately profile the board and optimize a profile (go to lower limit of process windo
Electronics Forum | Wed Oct 19 14:03:47 EDT 2022 | proceng1
Low Temp solder and a cooler profile should certainly help. I do believe that the unbalanced copper is the culprit, but you could try to prebake some boards. To eliminate some kind of manufacturing defect from the equation. Though I'm pretty sure i
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