Electronics Forum | Tue Jan 30 02:38:50 EST 2001 | arul2000
This BGA could have gone through the reflow cycle two times as we understand from the BGA manufacturer, during the BGA ball attachment process. (If any ball is found missing, they replace the missed ball manually after applying flux manually and refl
Electronics Forum | Mon Nov 13 14:58:56 EST 2017 | davef
Determine the origin of the solder * Sloppy paste printing technique * Lax stencil underside cleaning practices * Sloppy misprint cleaning practices * Poor part placement practices creating solder balls * Poor material control allowing solder p
Electronics Forum | Fri Jan 19 17:43:30 EST 2001 | davef
Intermetalic Layer (IL). A compound formed at the interface of two different metals, whose atoms have an extremely high natural attraction for each other, so high, that they do not bond to other elements by any other means. Also, intermetalic compo
Electronics Forum | Tue Nov 14 08:52:07 EST 2017 | davef
If you think the problem is occurring in the box and it is wide spread, consider replacing your solder paste with your paste supplier. There are paste formulations aimed at the solder balling issue that some LF pastes create. On tuning your reflow r
Electronics Forum | Mon Nov 06 21:06:13 EST 2000 | Dave F
Thomas: Wheeee, a 40% failure rate. Now, that make your boss chase you around the room won�t it? As you indicated, x-ray won�t do dip about helping to identifying problems [or ball cracks either]. Consider using an ERSA scope [er whatever they ca
Electronics Forum | Fri Sep 14 15:31:02 EDT 2001 | davef
How in earthly heaven would someone else have a report analyzing the defects on your boards? Among the good failure analysis labs that can assess situations like yours are: * Robisan Laboratory 6502 East 21 St Indianapolis, IN 46219 317-353-6249 fax
Electronics Forum | Mon Nov 13 21:31:11 EST 2017 | slah6678
Hi David, thanks for reply We did doing some study, most properly this problem was due to reflow process. Any thing that we can do for the reflow profile ? slow down the ramp up rate or .....
Electronics Forum | Mon Nov 13 21:27:02 EST 2017 | slah6678
Hi, thanks for reply. Kapton tape is costly and it may create another handling issue. BTW can you share the thread for the cleaning process ?
Electronics Forum | Tue Feb 06 23:01:44 EST 2007 | Wayne
The QFN is found to have contact problem during FCT. The paste that I am currently using is SnPb 63/37 water soluble paste. Is it because of water soluble paste? (unable to clean after reflow process as QFN is entrapped by paste/flux) Should we use
Electronics Forum | Thu Sep 15 12:43:37 EDT 2005 | pjc
Wave solder.
