Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Fri May 17 16:37:28 EDT 2002 | Tom Druan
I was wondering if anyone could direct me towards documentation on shear test methods/apparatus to test the bond integrity of a solder ball to its substrate. Thanks.
Electronics Forum | Wed Jun 07 21:45:53 EDT 2006 | davef
We do not understand the question. Take a deep breath, remember not all of us are trained as geologists. The smallest solder ball we've seen is a little less than 5 nm.
Electronics Forum | Fri May 17 16:53:50 EDT 2002 | davef
I recall a couple of papers in the SMTA 'Knowledgebase' that used ball shearing and an element in a study that compared BGA [maybe uBGA] component fabrication methods, er sumpin.
Electronics Forum | Wed Jun 07 21:54:11 EDT 2006 | mumtaz
Ha ha! davef finishes you guys off again!
Electronics Forum | Thu Jun 08 09:54:07 EDT 2006 | slthomas
Awwww, man. I was looking for something a little less on the anecdotal side for our local municipality's environmental stewards.
Electronics Forum | Thu Jun 01 16:30:05 EDT 2006 | slthomas
Just wondering if anyone knows this off the top of there head. I might be able to figure out the math based on surface tension (this is 63/37 so the data is out there) but I REALLY do not want to put that kind of effort into this. :/ Editing to clar
Electronics Forum | Tue Jun 06 15:45:18 EDT 2006 | slthomas
Yep. What I'm really looking for is the minimum radius of curvature for 63/37, which is a function of it's surface tension. It's physical properties issue, not an agency issue. I've seen some references that I have interpreted to mean that it's some
Electronics Forum | Thu Dec 07 10:10:49 EST 2006 | Learn from U
Hello, I need your advice..Welcome any input!! Cheers..
Electronics Forum | Thu Dec 07 14:23:30 EST 2006 | russ
I wuld say it is attachment method and post install force that is the problem not the size of the heatsink. we place heatsinks that are at least 5 times the size of BGA with no issue, they are attached with very precision torque drivers. Russ
