Electronics Forum | Fri Dec 13 10:06:05 EST 2013 | davef
For vertical mounted, axial leaded components; the standoff from the land to the component body should be 0.4mm[0.016in] to 1.5mm[0.059in]. Right?
Electronics Forum | Sat Dec 14 02:29:52 EST 2013 | padawanlinuxero
Hello I hope this helps For a component with axial leaded - vertical The clearance of the component body or weld bead above the land is 1.00mm (0.039in) Component body must be perpendicular to the board The overall height does not exceed maxim
Electronics Forum | Tue Jun 26 15:40:12 EDT 2012 | ssupertuba
Hello there, I'm presently experiencing some blow holes and solder voids in the solder fillet of caps on boards. They are ceramic caps. The solder is SAC105 and the parts range from 33pf to 0.1uf ceramic. Any suggestions?
Electronics Forum | Wed Jun 27 21:56:31 EDT 2012 | davef
I'm spinning on this. Are we talking PTH or SMT?
Electronics Forum | Thu Jun 28 09:43:25 EDT 2012 | ssupertuba
I'm sorry. These are SMT caps such as a C0805C271J1GAC. Small 0805 caps. I know they gennerally give you solder balls that sit on the side of those parts but they wash off.
Electronics Forum | Thu Jun 28 22:20:23 EDT 2012 | davef
John: Secure the capacitors that you removed from the machine ... * Removed capacitors have a problem * New replacement capacitors don't have a problem Find help to determine the difference between the two reels of parts
Electronics Forum | Thu Jun 28 09:57:50 EDT 2012 | mosborne1
blow holes and via holes are almost always caused by moisture and in PTH they could be moisture and improper drilled holes. If you are seeing solder balls next to the parts than I would say you have a reflow profile problem. Are you using any kind of
Electronics Forum | Thu Jun 28 16:43:51 EDT 2012 | ssupertuba
Yes I have a KIC and have checked the profile often. I just changed the reel of the parts that are causing problems and it went away. Now what am I suppose to say? I have made an NCMR for the parts but I'm sure they would work in an environment of
Electronics Forum | Thu Jun 28 17:05:46 EDT 2012 | davef
Here’s what we seem to know: * There’s a problem with voiding in the solder connections of SMT capacitors * A void is an open area caused by air or process fluid that is trapped within a solder connection * Voids are an allowable condition as long as
Electronics Forum | Wed Aug 23 08:05:50 EDT 2000 | Eugene Smelik
Dr. Lee: I have read that fillet lifting can be exacerbated by certain types of Pb-free solder. Can you explain which alloys cause this and why? Thanks! Gene Smelik Cookson Performance Solutions
