Electronics Forum | Tue Aug 10 15:47:34 EDT 1999 | John Thorup
| | | | | I am having cleaning problems when processing PCB's which have | | | | | TAIYO solder mask on them. After processing, hand soldering and | | | | | cleaning, a sticky residue is remains, resulting in a cosmetically poor finish with tide mark
Electronics Forum | Tue Aug 10 16:01:12 EDT 1999 | Earl Moon
| | | | | | I am having cleaning problems when processing PCB's which have | | | | | | TAIYO solder mask on them. After processing, hand soldering and | | | | | | cleaning, a sticky residue is remains, resulting in a cosmetically poor finish with tid
Electronics Forum | Wed Dec 18 09:04:29 EST 2002 | russ
Dave, You stated that an unfilled via is of greater strength than a filled or partially filled via. I posted to another thread recently and I stated that a filled via was of greater strength than an unfilled. I was tought (incorrectly?) that a fill
Electronics Forum | Tue Oct 19 16:59:58 EDT 1999 | Carol Zhang
Hi, thank you for the idea. I may try solder iron, but it much more slower since I have to solder spacers one by one. a stimpson press is used to press the spacer on the board and the edges of the spacers are rolled. Then we solder the edges to
Electronics Forum | Tue Oct 19 17:52:47 EDT 1999 | John Thorup
Hi Carol You can use a threaded standoff and put a screw through the board and into the standoff with the screw from the buss bar coming into the other end of the standoff. You should use a SEMS type screw or a internal star type lockwasher with a pl
Electronics Forum | Wed Dec 18 10:10:07 EST 2002 | davef
No, sorry not on "Dave's Bookshelf". My basis is a study done at IBM. I reference it here: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=4941&#Message19050 Responding differently, you're correct. If you have a
Electronics Forum | Tue Dec 17 12:53:28 EST 2002 | russ
You looked one page to far in the IPC book! Fillet height of 75% is acceptable for all 3 classes. Per IPC 610 rev. C Section 6 table 6.2. A. Circumferential wetting on Primary side (top)between lead and barrel (not anualar ring) Class 1 Not spe
Electronics Forum | Sun Aug 15 05:45:15 EDT 1999 | Brian
Boca, Dave Sorry, but I cannot let this go. I'll go along with you that, at the time that the Montreal Protocol was initially signed (September 1987), there was no scientific proof that CFCs etc. were causing ozone depletion. There was, however, ve
Electronics Forum | Mon Apr 04 22:40:07 EDT 2005 | davef
We'd contact suppliers of LPISM. Top LPISM available in the United States are: * Coates ImageCure XV501T & XV501TSM * Coates ImageFlex (Flexible Solder Mask) SV 601T * Enthone DSR 3241 and DSR 3241 GM * Rogers RFlex 8080 LP1 & RFlex 8080 LP3 (Flexib
Electronics Forum | Wed Apr 06 07:28:54 EDT 2005 | liv2xplr
Besides the solder mask suppliers, I would contact some makers of exposure and alignment equipment. Try OLEC (www.olec.com) - they make different types of expsoure equipment. Another good source is a company called All-4-PCB (they rep a number of P
