Electronics Forum | Mon Jul 16 21:25:26 EDT 2001 | davef
Sure, use of U-shape apertures is another way to reduce the amount of paste that you apply. That and similar schemes mentioned in the article are not a function of the flux used. We have used U-shaped apertures for MELF and mini-MELF. They are sug
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Thu Jan 27 14:49:53 EST 2000 | Glenn Robertson
Tuan - One of the reasons I suggested pre-tinning (aside from the negative effects of Gold on appearance and reliability) is the known slower wetting of Sn/Ag and Sn/Cu alloys as compared to Sn/Pb. If you don't have to be Lead-free, the high Lead
Electronics Forum | Mon May 10 08:00:14 EDT 1999 | Timothy O'Neill
| | | | I am about to embark on an effort to evaluate 3 different solder material suppliers and their recommended materials for our assembly process, in an effort to find the best supplier/material. We do mixed technology, with NOCLEAN chemistry so
Electronics Forum | Tue May 04 14:42:58 EDT 1999 | Chrys Shea
| | I am about to embark on an effort to evaluate 3 different solder material suppliers and their recommended materials for our assembly process, in an effort to find the best supplier/material. We do mixed technology, with NOCLEAN chemistry so I wi
Electronics Forum | Mon May 10 07:53:48 EDT 1999 | Timothy O'Neill
| | | I am about to embark on an effort to evaluate 3 different solder material suppliers and their recommended materials for our assembly process, in an effort to find the best supplier/material. We do mixed technology, with NOCLEAN chemistry so I
Electronics Forum | Tue Mar 14 20:42:24 EDT 2023 | stephendo
In a previous lifetime, we had a selective solder machine where I would see solder splashes in the roof of it. I thought someone might have been putting the solder extremely high. But when it was melting there would be bubbles that burst. The manufac
Electronics Forum | Wed Jun 15 13:10:58 EDT 2005 | Steve
Call me Stupid? no, don't but wouldnt the "Panty Hose" melt under the heat conditions?
Electronics Forum | Thu Jul 14 03:01:37 EDT 2005 | fctassembly
Chris, The Asahi SCS7 is Asahi's attempt at copying the SN100C and is a tin/copper/silicon alloy that melts at 227C so no, it is not a low temperature lead free alloy.
Electronics Forum | Thu Nov 18 03:54:49 EST 1999 | jacky
Hello,everyone, I want to know how I can test the reliability of the solder point.And now we just push or pull the components to test the reliability of solder point,but I don't know if there is any measure of the power applied to the component
