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Electronics Forum | Thu Apr 26 13:17:10 EDT 2007 | jerrysaise
�It adds NO VALUE whatsoever to do 3D inspection as part of in-line production.�
Electronics Forum | Thu Jan 03 08:02:53 EST 2002 | davef
Slump is a function of the particular paste you select and the temperature of the paste. Use a slump test like the one that follows to compare fluxes. Slump Test Step Process activity 1 Print paste on white ceramic substrate or microscope sli
Electronics Forum | Thu Apr 26 09:03:35 EDT 2007 | ck_the_flip
3d is good for initial verification that your screen printer and stencil is producing the desired paste height. 2D verification is more than sufficient during regular production. That being said, your best bet for a 3D machine is to go cheap - buy
Electronics Forum | Fri Apr 27 10:33:58 EDT 2007 | ck_the_flip
Jeremy, well said! Thanks for "validating" my theory... LOL I agree that the sampling frequency, AND methodology are key things with 3D inspection. 3D will give you some insight onto how your paste (rheology, viscosity, thixotropy)AND process are
Electronics Forum | Thu Apr 26 19:06:08 EDT 2007 | grayman
In short this guys are not well updated on the new technology of SPI. True, 3D IN LINE SPI is no longer a slow machine. Try checking some brand like Cyberoptics,Synapse imaging,SEIMENS,KOHYOUNG and many others...they can match the speed os some mount
Electronics Forum | Wed Dec 14 06:18:20 EST 2005 | tk380514
right again grant, consider the fact that if you spend enough time inspecting the soldered boards/pre-oven and check the BGA solder paste pads before, and clean the stencil regularly and check solder paste dryness, check oven profiles then after chec
Electronics Forum | Sat Dec 03 16:26:40 EST 2005 | grantp
Hi, I have seen demos of these scopes, and don't think they really show you very much. If you profile your board right, and drill up to solder a thermocouple onto the inner balls of the device so you really know your getting a good profile, I don't
Electronics Forum | Thu Apr 27 21:20:38 EDT 2000 | Dean
Here are some pointers to use during your X-ray inspection. Microcracking is virtually impossible to determine with X-ray. However, I suspect you are looking for "hard" opens. Those are much easier to find visually. If using a paste-and-place pro
Electronics Forum | Tue Jun 05 16:40:46 EDT 2001 | kerryn
Thanks Phil. However, my objective is to identify stencils that are not 100% clean prior to sending to inventory. I want to catch it before the solder paste has a chance to dry and harden in the apertures. Kerry
Electronics Forum | Wed Mar 14 17:11:57 EST 2001 | davef
First, x-ray inspection machines have a wide range of capilities. Resolution is a key measure of a machine's ability to "distinguish" features. People say that some x-ray inspection machines have the ability to position the board being inspected at
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