Electronics Forum | Mon Apr 12 09:36:57 EDT 2004 | wgaffubar
Russ, These are the pb free components that you mentioned that are coming around the bend. Not the old CBGA's. I use to use CBGA's alot with former company. These are 15 x 15 mm plastic BGA's with 14 mil pg free solder balls going on 8 mil gold pads.
Electronics Forum | Tue Aug 26 12:52:04 EDT 2008 | circleprime
I have recently started to use RMA flux (customer requirement) for some of our projects. I am finding that some of my BGAs are slightly off. Not enough to be rejected but enough to cause concern. In the past I have been able to rely on the surface te
Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef
Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially
Electronics Forum | Wed May 22 19:10:47 EDT 2013 | anvil1021
We do a lot of these devices and I guess I am not familiar the term "Dry Solder". The QFN device is not designed to have a drain hole, but needs to have thermal vias to control heat in most cases. We have used every possible gnd pad design and modifi
Electronics Forum | Mon Jul 21 08:34:44 EDT 2003 | Don Bell
Blow holes/ pin holes in solder joints are the result of multiple root causes. Suggested analysis might look like this; 1) What method of solder preservation is used on the bare board. (hasl,enig, osp, etc.) HASL can leave unwanted flux residues,
Electronics Forum | Sun May 21 05:54:04 EDT 2000 | Sal
Currently manufacturing double-sided PCMCIA cards with a nickel/gold finish, which are 0.0235thou in thickness, using surface mount carriers. Problem we are seeing is when building the densely populated side on the second pass we are seeing lifting o
Electronics Forum | Sun Mar 18 23:01:11 EDT 2007 | diesel_1t
Hi there, I want help on the following issue. Where I work, we place a component QFP 256 terminals (20 mil pitch)from hitachi (renesas), we use a MPM UP-3000 screen printer, IP-III placement machine and Vitronics 8 zones reflow Oven. lead plating
Electronics Forum | Thu Aug 31 18:59:55 EDT 2000 | Brian W.
Our customers use OSP, HASL, immersion tin and immersion gold as board finishes. If I recommend a finish to the customer, it is one of the immersion finishes or OSP. Those finishes have the advantage of a flat surface to deposit paste. HASL has va
Electronics Forum | Wed May 16 15:40:56 EDT 2012 | davef
Here's some notes from a Bob Willis presentation Assembly of Flexible Circuits with Lead-Free Solder Alloy [Bob Willis leadfreesoldering.com] * Flexible Circuit Construction ** Base Material - 0.05mm Copper 18/18 um ESPANEX from Holders Technologies
Electronics Forum | Sun Jan 14 16:35:48 EST 2007 | Austin
I have several boards built at various CM's. We have prototype builds with some JTAG failures on BGA's (1-3 failures with qty 3, 1500 pin BGA's). CM's always claim reflow profiles look good. X-ray does not show bridges and they claim it looks good, b
