Electronics Forum | Fri Jul 24 07:43:56 EDT 2009 | davef
Your customer is correct. You are doing something wrong in your hand soldering process. Solder balls are a process indicator. Areas to assess are: * Moisture content of the bare board * Thickness of the copper plating in the through holes * Temperatu
Electronics Forum | Fri Aug 26 17:27:48 EDT 2005 | saragorcos
Hello there, Most probably, since the solder balls are entrapped, it is a process indicator, but refer to IPC 610-6.5.3.1 on Excess solder / solder balls / splashes - it really depends on what class you are manufacturing, and the minimum electrical c
Electronics Forum | Wed Apr 29 01:38:38 EDT 2009 | nibirta
already did this test. No solder balls. i have printed the pads without the component. No solder balls. Only with the component. The problem is, it splashing the around components. solder balls wew found on the body of a connector and on top of it. T
Electronics Forum | Thu Dec 10 22:36:03 EST 2020 | solderingpro
I represent PROMATION USA and we have several solutions for solder wire perforation: Our QUICK 372B is a stand-alone drilling station. Our QUICK 371DI is a semi-automatic hand soldering station with perforation technology. Our QUICK 300A/B is a d
Electronics Forum | Tue Sep 15 14:11:59 EDT 2015 | jpal
You should also remove all the pump parts and clean them, checking the bearings and seals. Clean completely the parts that allow the solder to flow back into the pot; ours have a spiral that fills with dross. Treat yourself to new nozzles. Tinning
Electronics Forum | Tue Jun 04 12:54:00 EDT 2002 | Bob
Hi, We are manufacturing a small PCB with large areas of gold plating. We experience from time to time what appear to be solder splashes on the gold areas. I do not believe the contamination to be from "outgassing" due to the distance from the dep
Electronics Forum | Wed Mar 21 16:32:03 EST 2001 | mparker
The root cause is dependant on the type of solder "splash", ball, whatever, that you are seeing post reflow. If it is smears, then cleaning the stencil underside is probably the answer. Are you using automatic wipers? How many print cycles between w
Electronics Forum | Thu Jun 28 10:58:28 EDT 2001 | brownsj
The question is are you talking of a reflow or wavesolder process. If your talking reflow I used to use a stepped stencil to ensure I had sufficient paste and then make a double pass with my squeegees. First pass with a 45 degree rubber squeegee to f
Electronics Forum | Tue Jul 10 07:22:48 EDT 2007 | davef
Q1. Is kapton tape an industry accepted way of protecting gold pads from solder splashes? A1. No. It is more accepted to resolve the reason behind the solder splats, so that the added labor and cost of taping is eliminated. Search the fine SMTnet Arc
Electronics Forum | Thu Jul 17 20:46:55 EDT 2008 | davef
Which type? * Solder beads (mid-chip solder balls, attached to the waste line of your chip caps and resistors) This is more paste volume related. * Solder balls that tend to be more randomly scattered (as in spattered)? This tends to be more profile
