Electronics Forum | Thu Jun 13 11:29:18 EDT 2002 | davef
An ounce of prevention is worth a pound of cure. Why not figure-out and correct the cause these solder splatters? Let�s talk about what�s going on here. Tell us about component, near-by components, solder, bare board, soldering method, process, et
Electronics Forum | Thu Jun 13 08:14:23 EDT 2002 | edahi
any of you guys got any ideas to clear up this stuff of the package surface?? I know this is just a cosmetic defect but one of our packages get splatters on the marking area so this is something I have to fix... inputs are very much welcome...
Electronics Forum | Fri Feb 08 16:21:15 EST 2013 | spitkis2
Are you doing this to minimize solder paste splattering? Is this a value that you use for all QFN's (would the overall size of a QFN matter)? I was told reducing placement force with these components is recommended so just was wondering what is bein
Electronics Forum | Tue Jul 15 15:46:05 EDT 2008 | slthomas
Can you describe your solder balls...mid-chip solder balls, "splatter" around pads, etc.?
Electronics Forum | Thu Mar 20 08:45:02 EDT 2008 | davef
Common methods use to protect pads from solder splatter are: * No residue Kapton tape * Nonionic solder mask
Electronics Forum | Mon Jun 17 21:20:48 EDT 2002 | davef
Consider slowing down the rate of heating during reflow to eliminate the ejactula. Well, if you feel this is caused by your customer�s design, it is repeatable, you think it�s coming from the reflow process, and you think your reflow process is well
Electronics Forum | Thu Jun 20 05:50:29 EDT 2002 | edahi
thanks yeah we are very much looking at the reflow because the package is ceramic tough "scratch" the tape idea because the gold pad is a marking area and the surface might be contaminated and it might cause illegible marking. the slow ramp up i'll
Electronics Forum | Tue Jan 21 00:44:30 EST 2014 | leardkattiya
Hi All, I have a question to ask. Do we really need ESD kapton tape to be use inside SMT line/ production? Anyway the purpose of the kapton tape is to protect gold finger/ wirebond area from solder splatter. Please advise.
Electronics Forum | Wed Jan 31 05:23:37 EST 2007 | pbarton
Barry, We do not see much in the way of solder splatter or solder balling. We have removed some parts but in the process of doing so we remove any useful evidence really. Quite a lot of the solderable portion of the part is on the underside. Like
Electronics Forum | Fri Jul 06 10:45:02 EDT 2012 | ashworth14
In relation to question 2 the vacume on them is quite sensitive so as long as you bring it down slowly the component is almost sucked up off the PCB so you don't have to actually press it down on the the component, and i have never experienced any so
