Electronics Forum: solder splatter (Page 5 of 9)

LGA and Solderballs

Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef

J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause

Pick Up Error

Electronics Forum | Thu Aug 12 14:55:08 EDT 2004 | johnw

Hi guys I havnt been on for a while so its nice to be back been working in europe mostly Fuji CP6 skewing rnets Marcels comment is the closest rnets are a problem as said before the main areas are 1 A good assmbley shape is a must with 30% defaul

Lead free profile

Electronics Forum | Sat Feb 05 23:54:37 EST 2005 | sms_don

Hello, I found the previous discussion of lead free profiles on 5 zone ovens very interesting. I had the same concerns, but have recently succeeded in creating profiles on a 5 Zone QUAD oven that have eliminated solder splatter or Solder on Gold w

Long Soak Times for BGA soldering?

Electronics Forum | Sat Jul 03 00:58:57 EDT 2004 | KEN

so what did we do before X-ray? sound process shouldn't need to rely on inspection. Extended soaks can be used to burn off high temp volatiles but I have never heard of 5 minutes! I have used 90-120 sec. to reduce solder splatter....but haven't do

Soler Paste Flux %

Electronics Forum | Thu Jun 09 03:16:06 EDT 2005 | PSGill

I'm using Kester R520A Lead free solder paste. The flux % stated on the Certificate of Analysis(COA) when the product delivered to us is 10 %. The tolerance is 1%. But when i send the jar to an external lab to determine the flux % it is more than 11%

IR Rework Machine

Electronics Forum | Thu Jun 28 15:22:59 EDT 2012 | spitkis2

Would like to ask end users or those with experience using infra red rework equipment (specifically when the top heater is IR) the following: 1. Can you successfully rework Package On Package (PoP) type devices? With heat directed through the packa

ESD kapton tape for SMT production use

Electronics Forum | Tue Jan 21 13:40:00 EST 2014 | rgduval

If you're using the Kapton tape to protect the gold fingers from solder splatter, my first instinct is to say,yes, you do need it. I've had the pleasure of paying to have gold fingers reworked in the past. It is not in-expensive; certainly not equa

Pasting ahead

Electronics Forum | Mon Nov 13 10:02:52 EST 2006 | pforister

Bill, We only allow 3 boards to be printed in front of the pick and place equipment. It is important to keep the abandon time to a minimum. You did not mention the paste that you use. Do you use no-clean or water soluble? Do you use lead free?

Solder Balls

Electronics Forum | Tue Mar 31 08:11:51 EDT 2009 | davef

Solder ball formation can be a significant problem if the balls get trapped in the smaller spaces between ceramic chip carriers and substrates or possibly between the leads of small pitch leaded ICs. The solder balls also reduce the solder volume ava

Gold Contacts

Electronics Forum | Fri Mar 23 11:58:01 EST 2001 | mparker

You are mixing long exposed paste back into fresh? How long has your fresh jar been open to the air? You are probably doing yourself a disservice by scavenging the paste (it could have moisture entrapped). Your visocity has definitely changed. You a


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