Industry News: solder-ball (Page 5 of 26)

SHENMAO Presents Technical Paper at SMTA/ICSR Conference

Industry News | 2016-04-21 00:17:09.0

SHENMAO Technology will present the technical paper "A New Dispensing Solder Paste for Laser Soldering Technology" at the 10th. Anniversary of the SMTA International Conference of Soldering and Reliability 2016 in Toronto, Canada, featuring advancements in newly developed composition of Powder, Fluxes and produces best dispensability, minimal flux residue, no-splash or solder balling issues and minimal and smaller voids.

Shenmao Technology Inc.

Pin In Hole, Pin in Paste or Selective Reflow CD from Bob Willis

Industry News | 2017-01-18 05:21:35.0

This photo CD ROM provides the process or quality engineer with a source of PIHR photographs of the assembly process, components and process defects which may be used in company inspection document or training presentations. They may be simply pasted into any document for in house company use. Now over 250 photographs are provided in either jpg or tif file format for use in PowerPoint, Word inspection standards or online publications royalty free http://www.bobwillis.co.uk/product-category/photo-cd-rom/

ASKbobwillis.com

What is a Ball Grid Array?

Industry News | 2018-10-18 10:22:15.0

What is a Ball Grid Array?

Flason Electronic Co.,limited

Bob Willis 2021 Online Webinars Launched

Industry News | 2020-11-14 08:21:00.0

​Our webinars for 2021 have now been launched with the first three dates for January, February and March available to book online. In addition our growing library of online archive video recordings are ready to provide support and education world wide from our website bobwillis.co.uk Solder Wicking Defects - Benefits, Causes & Cures 11th Jan at 2.30pm UK Time Solder Ball Elimination – In Wave, Selective & Reflow - Webinar 8th Feb at 2.30pm UK Time Dendrite & Corrosion Failure on PCBs – Causes & Cures - Webinar 8th March at 2.30pm UK Time

ASKbobwillis.com

EasySpheres Solder Spheres – Any Size, Any Alloy, Overnight

Industry News | 2021-06-02 05:34:04.0

EasySpheres is the exclusive worldwide provider of high quality, first run solder balls at reasonable quantities and excellent prices. The company is a leading provider and technical guide to many of the solder attach and bumping challenges that customers face today.

EasySpheres LLC

TopLine Offers Bonding Wire, CCGA, Solutions at Productronica 2023

Industry News | 2023-10-23 09:52:43.0

TopLine's CCGA Column Grid Array IC packages and large Ball Grid Array (BGA) package solutions will highlight the company's exhibit at Productronica 2023. TopLine will exhibit in Hall A4.460, and the solutions offered by TopLine will include Bonding Wire, CCGA solder columns, IC Chip Trays, Daisy Chain Dummy Components, and PCB Jumpers.

TopLine Dummy Components

MARTIN to Demonstrate Compact, Stand-alone BGA Reball Unit at APEX 2010

Industry News | 2010-03-24 13:39:18.0

MARTIN, a FINETECH company, will demonstrate the Reball 03.1 unit in booth #638 at the upcoming IPC/APEX exhibition, scheduled for April 6-8, 2010 at the Mandalay Bay Convention Center in Las Vegas, NV.

Finetech

ViTrox Technologies' V810 Selected as Finalist for 2012 Best in Test Awards

Industry News | 2011-11-03 21:29:45.0

ViTrox Technologies announces that its V810 Automated 3-D In-Line X-ray Inspection System has been selected as a finalist for the 2012 Best in Test Awards.

ViTrox Technologies

Indium Corporation Introduces Wave Solder Flux for

Industry News | 2004-09-22 14:23:28.0

Indium Corporation of America has introduced Wave Solder Flux 3592-35 specifically developed for the Pb-free wave soldering of mixed-technology and through-hole electronic assemblies.

Indium Corporation

Indium Corporation Introduces New Pb-Free VOC-Free Wave Solder Flux

Industry News | 2004-11-24 16:07:30.0

The Indium Corporation of America has introduced 1075-EXR 46 wave solder flux specifically designed to meet the process demands of Pb-Free manufacturing. 1075-EXR 46 is a VOC-Free material formulated for Pb-Free wave soldering of surface-mount, mixed-technology and through-hole electronics assemblies.

Indium Corporation


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