Electronics Forum | Wed Feb 07 11:27:25 EST 2007 | asoe
I just wonder anyone had the idea of solderability test for through hole by using a wetting balance equipment? I read the jstd002/003 however my feel is now our machine (metronelec st60) is not capable of this test?
Electronics Forum | Wed Aug 27 23:00:55 EDT 2008 | omid_juve
i mean that the parts that we have here is ROHS compliant(pb free)but the process that we have(the type of solder paste & the surface finish of the board has pb in its mixture) this is not the cause of problem ?
Electronics Forum | Fri Aug 29 02:47:31 EDT 2008 | omid_juve
i read in smt soldering handbook that by placing the device in a 125`c within 48 hours the moisture will be removed what do you think about this method ?
Electronics Forum | Tue Sep 02 12:43:12 EDT 2008 | stepheniii
That could lead to oxidation of the leads and worsen solderability. It's much better to make sure the components are handled properly and not exposed to moisture. The reason for baking is moisture in the body not in the leads. Why is no one suggest
Electronics Forum | Wed Sep 03 12:29:47 EDT 2008 | omid_juve
That could lead to oxidation of the leads and > worsen solderability. It's much better to make > sure the components are handled properly and not > exposed to moisture. > > The reason for baking is > moisture in the body not in the leads. > > W
Electronics Forum | Fri Oct 29 11:42:04 EDT 2010 | pfloh
For my opinion, this will not the end for you yet if supplier unable to provide you the rootcauses and corrections. I faced this more than 3 times within 2 years. All type of lab tests (SEM, FTIR,cross-sectioning,solderability tests, and etc.) They
Electronics Forum | Mon Apr 19 10:52:05 EDT 2010 | esca
Hi, if you want to verify the gold contamination, is mandatory to use the XPS and FTIR analysis, but is difficult think about a gold contamination from 3 different manufacturers. Do you have cleaned the PCBs after an erroneous screen process ? If no
Electronics Forum | Thu Sep 04 13:09:27 EDT 2008 | realchunks
This is fine from a quality engineers point of veiw, but as you said the vendor never admits to nothing. So the company that has the problem has to resolve the problem for themselves. Generally this turns into a finger being pointed at the process
Electronics Forum | Wed Sep 10 17:12:55 EDT 2008 | gregoryyork
I dont know about analysis on boards it is OK as long as the people carrying it out know how to interogate the answers.I worked on a problem just last week where an analysis house in China tested the resist then the pads and found on both surfaces C
Electronics Forum | Mon Sep 20 11:21:48 EDT 2010 | tony1
I have this NiPdAu small QFN packge sizes less than 2x2. I tried to do solderability Dip And Look test and there's always some units no wet on either ground pad and small I/O. Can someone help to explain why is this so difficult to set on this surfac
