Electronics Forum | Tue Feb 14 13:16:49 EST 2006 | Carol Stirling
CRITICAL DILEMA! Has anyone run into the problem described below and if so, what was the fix (besides not dealing with this Supplier)? Also, we do not have component manufacturing process experience. We are purchasing a surge resistor that function
Electronics Forum | Fri Sep 14 12:22:49 EDT 2012 | grauen06
The Alpha EF-9301 flux worked great! We went from ~4 solder issues per PCB to
Electronics Forum | Sat Sep 13 09:06:06 EDT 2008 | wavemasterlarry
Its you
Electronics Forum | Fri Jul 23 02:17:26 EDT 2010 | joseph_smile
by viewing your posting i came to know this is solder ability issue which is because of marginable solder ability of PCB / components, just ensure that issue due to PCB or component . check the msl of of substrate / component. verify the baking r
Electronics Forum | Mon Oct 27 20:01:00 EDT 2014 | rangarajd
Hello, We are facing solderability issues on a particular lot of board. THe Nickel thickness measured with an XRF is around 400 U inches. Spec calls out for 130 u inches Nickel and 3 - 5 U inches gold over it. Assuming there is no porosity on the g
Electronics Forum | Thu Sep 11 10:45:41 EDT 2008 | diesel_1t
Is just me, or too many "soldering issues" have been observed lately? on this forum... could be a ~90% components "backwards/compatible" in both leaded/lead free process?
Electronics Forum | Tue Aug 23 16:58:34 EDT 2011 | asksmt
Hi, Any one known if it is really benificial to enlarge the end pads width of SSOP package ? does this really solve any cold solder issue ? facing some cold solder issues on one design only ! Please suggest ! Thanks alot in advanced..!
Electronics Forum | Thu Aug 13 18:20:44 EDT 2020 | rgduval
Are you getting the same solder issues on all of the components on the board? Any consistency in the ones that come up with no-solder? Same pins, same orientation, etc? Could be a solderability issue on the component or pads. I hate random issues
Electronics Forum | Tue Apr 15 21:24:41 EDT 2008 | davef
We find it curious that: * Heat slug pad for Q19 didn't take solder, indicating a pad [board] solderability issue. * Signal termination pads for Q19 didn't flow well, indicating a poor thermal recipe or a pad [board] solderability issue. * Signal ter
Electronics Forum | Tue Jul 20 15:10:00 EDT 2010 | vetteboy86
Recently we have expereinced solder issues with our reflow process. The issue is random and doesn't effect every assembly. I'm seeing extreme solder wicking, no solder flow onto the pads, only onto the leads of the components. I have tried to hand
