Electronics Forum | Tue Apr 13 17:44:29 EDT 1999 | Christopher Lampron
| We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to
Electronics Forum | Tue Aug 30 09:24:08 EDT 2005 | Slaine
we manufacture a range of ceramic parts that have silver termination,there is already a small leaching problem (absorption of the termination by the solder in liquid form)with Sn62 that we live with, having to implement unleaded solder they are norma
Electronics Forum | Tue Aug 30 12:49:59 EDT 2005 | Ted
Slaine, We use a Pd/Ag thickfilm paste. Because of the leaching we had to start using solder pastes that have silver in it. For RoHS, we are using a solder paste with an alloy of Sn95/Ag05. We also have to double print the thickfilm pastes. I h
Electronics Forum | Tue Apr 09 00:26:46 EDT 2002 | craigj
Are currently investigating a change of solder paste for various reasons and are considering a move from 63/37 to using 2% silver solder paste for increased long term reliabilty of solder joints with gold finish PCBs and to further reduce reflow temp
Electronics Forum | Thu Mar 28 14:04:16 EST 2002 | davef
Intermetalic Layer (IL). A compound formed at the interface of two different metals, whose atoms have an extremely high natural attraction for each other, so high, that they do not bond to other elements by any other means. Also, intermetalic compo
Electronics Forum | Tue Apr 09 08:25:55 EDT 2002 | davef
Search the fine SMTnet Archives.
Electronics Forum | Mon Apr 01 07:41:40 EST 2002 | davef
Hey Bob, Boy, you are lucky to have a laboratory, and now colorful pix!!! The only silver IMC that you will see are: * Ag6Sn, much less likely at 'normal' soldering temperatures * Ag3Sn, much more likely Allowable silver concentration: * Below 2%
Electronics Forum | Tue Apr 09 05:36:27 EDT 2002 | lhudson1
Silver in the paste is present to minimise any negative effects of silver in the pcb finish or component terminations. 2% Ag prevent silver leaching thus giving a more reliable joint.
Electronics Forum | Fri Nov 19 01:55:44 EST 2004 | Chics
Hi, Is anyone aware of the Mesh sizes(Screen Printing) that are against specific silver particle sizes. Like in case of solder for different types of paste, different mash sizes are recommended. Is anyone aware of any such things in the case of silve
Electronics Forum | Sun Mar 31 10:03:25 EST 2002 | Bob
Cheers Dave, to answer some of your questions. � The component lead is copper with a tin / lead coating. The pads are standard Copper / Nickel / Gold. � The solder is standard Tin / Lead / Silver (2%) We have a lab that can determine the composition
