Electronics Forum | Mon May 24 13:33:46 EDT 1999 | Dave F
| We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendor
Electronics Forum | Fri Mar 23 09:28:46 EST 2001 | PeteC
Well, it's hard to say what it started out as, a smear, splash or ball cause the solder formation on the finger after reflow is spread out ya know. I looked at an archive for possible causes and one was printer operators with paste on their fingers.
Electronics Forum | Tue Jun 06 13:47:10 EDT 2023 | oxygensmd
In Hungary there are many EKRAs. Bosch, Zollner and many big/small company are using them. I also saw the latest DEK but I think DEK is over-complicated, fast and good printer - but if you have any problem, it cost a lot. MPM also nice machine but I
Electronics Forum | Wed Jan 29 10:13:20 EST 2020 | spoiltforchoice
> Spoilit... and Phil, it is your regular 29" > frame, but it is thinner - 13mm is what I > measured. For your vendor this is cheaper as they > give you less metal, so usually these have lower > price. I assume all stencil ve
Electronics Forum | Thu Mar 29 15:29:11 EST 2001 | johnw
measuring Paste volume or at least paste height is an essencial part of any SMT process. You've got to control those input's.... Paste volume determines how much solder is available for your joint so theres a direct to joint reliability / PCB reliabi
Electronics Forum | Thu Aug 13 14:10:01 EDT 2015 | markhoch
Hi Sam, I have a feeling that what you're trying to communicate is that your DPAK's are skewing off the pad during reflow. This is caused by a thermal "mismatch" where the solder paste on one side of the DPAK becomes molten before the other, then th
Electronics Forum | Tue Jun 06 14:26:00 EDT 2023 | spoiltforchoice
> In Hungary there are many EKRAs. Bosch, Zollner > and many big/small company are using them. I also > saw the latest DEK but I think DEK is > over-complicated, fast and good printer - but if > you have any problem, it cost a lot.
Electronics Forum | Fri Mar 06 10:30:46 EST 1998 | Ron Costa
| | | Hello everyone! | | | Does any know anything about bare board size variations? | | | Is there a spec. or tolerance? | | | I'm running small lots of boards and during the screen printing process | | | I find that I cannot paste each board perfec
Electronics Forum | Tue Sep 01 10:39:30 EDT 1998 | Mike
| | | We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | | | Our pad design is .020" diameter pads with .025" solder resist diameter.
Electronics Forum | Fri Jul 30 17:13:30 EDT 1999 | Dave F
| | | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly
