Electronics Forum: structural test (Page 5 of 7)

Re: How to qualify the solder flux of a new vendor?

Electronics Forum | Wed Nov 17 11:20:23 EST 1999 | Dave F

Hey Gyver: If you don�t mind (which you don�t have any choice about, because I�m going to do it anyhow, cause it�s MY word processor), I�m going to respond genericly, but still be directed to your question. Much of the following is paraphrased from

Re: Void in solder bump

Electronics Forum | Fri Aug 06 10:27:05 EDT 1999 | Kenneth Hedman

| | I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | | | Thank you, |

MANEX ERP or DBA Manufacturing - any user comments?

Electronics Forum | Fri Sep 28 14:12:10 EDT 2007 | rgduval

Peter, I've used both systems, and can offer the following: Manex (xERP, last I knew) is a pretty inclusive set of manufacturing, inventory, accounting, and planning set of software. I used mostly the manufacturing side of things, and found that,

Re: Cleaning procedures for Entek-Plus Cu-106A

Electronics Forum | Mon Apr 26 17:45:26 EDT 1999 | Earl Moon

| | | Earl said, in essence: | | | | | | | Justin is absolutely right ... | | | | | | | | Again, Entek is not much more than a flux coating ... | | | | | | | | Metallic coatings protect best, as we all know - especially those electroplated. Those

Re: Qualifying new PWB Vendors

Electronics Forum | Sat Jan 16 02:43:21 EST 1999 | Earl Moon

| Hello, | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | So far, the tests I can think of performing, and that we have

Re: Black spots on gold finish pads.

Electronics Forum | Tue Dec 01 09:02:18 EST 1998 | Earl Moon

| | | Hi folks , | | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our in

Re: Black spots on gold finish pads.

Electronics Forum | Fri Dec 04 20:26:34 EST 1998 | kallol Chakraborty

| | | | Hi folks , | | | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Ou

Re: Black spots on gold finish pads.

Electronics Forum | Fri Dec 04 20:37:45 EST 1998 | kallol chakraborty

| | | | | Hi folks , | | | | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most

Re: BGA problem: open after reflow

Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef

We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng

AOI vs. XRay

Electronics Forum | Thu May 10 10:33:46 EDT 2001 | Eyal Duzy

Genny, I would like to correct part of the things that you were told. As far as I know, X-Ray tools are not positioned as tools to find solder volume simply because it is not a strong point for them. An X-Ray image is either a projection (2D transm


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