Electronics Forum | Fri Sep 13 18:01:39 EDT 2002 | dbonilla
Do you know what will be the best solder process for pins at the edge of the ceramic substrate? Thanks
Electronics Forum | Thu Oct 31 11:23:32 EST 2002 | yngwie
Any input to my question ?
Electronics Forum | Fri Aug 13 19:33:51 EDT 2004 | Carl
Also, excessive time at reflow really begins to stress the substrate and components as well.
Electronics Forum | Tue May 24 10:07:50 EDT 2011 | ck_the_flip
Does anyone have experience singulating CEM-1 substrates?
Electronics Forum | Fri Dec 16 13:37:52 EST 2016 | edhare
Hi all, > > Recently, we are trying to do > wire bonding between a 75 * 75 um pad on a chip > and substrate with 150 um height difference, but > when completing wire bonding and the wire bonds > on pad and substrate, the pad will get out of
Electronics Forum | Mon Jan 30 15:32:14 EST 2017 | davef
so, why are your laminates warped? What needs to be done to correct that issue?
Electronics Forum | Mon Jan 30 19:29:50 EST 2017 | swag
Tacsil is another product you might try.
Electronics Forum | Sat Jul 28 04:17:47 EDT 2018 | blusmart
Thinking very well
Electronics Forum | Thu Feb 25 18:39:03 EST 2021 | cyber_wolf
Laser the barcode on a label and place it on the board. Trying laser the substrate does not work well.
Electronics Forum | Thu Nov 09 01:17:28 EST 2000 | DL
John, Ahhhh the possibilities. Have you considered the dissipative properties of available substrates? A ceramic (excellent heat dissipation) based substrate could be a possibility for future designs. Maybe there are surface mount parts out there fo